Open AccessArticle
Study of Impact Damage in PVA-ECC Beam under Low-Velocity Impact Loading Using Piezoceramic Transducers and PVDF Thin-Film Transducers
by
Baoxin Qi 1,2,†, Qingzhao Kong 2,*,†, Hui Qian 3, Devendra Patil 2, Ing Lim 4, Mo Li 5, Dong Liu 2 and Gangbing Song 2,4
1
College of Civil Engineering, Shenyang Jianzhu University, Shenyang 110168, China
2
Department of Mechanical Engineering, University of Houston, Houston, TX 77204, USA
3
College of Civil Engineering, Zhengzhou University, Zhengzhou 450001, China
4
Department of Civil and Environmental Engineering, University of Houston, Houston, TX 77204, USA
5
Department of Civil and Environmental Engineering, University of California, E4145 Engineering Gateway, Irvine, CA 92617, USA
†
These authors contributed equally to this paper.
Cited by 41 | Viewed by 5039
Abstract
Compared to conventional concrete, polyvinyl alcohol fiber reinforced engineering cementitious composite (PVA-ECC) offers high-strength, ductility, formability, and excellent fatigue resistance. However, impact-induced structural damage is a major concern and has not been previously characterized in PVA-ECC structures. We investigate the damage of PVA-ECC
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Compared to conventional concrete, polyvinyl alcohol fiber reinforced engineering cementitious composite (PVA-ECC) offers high-strength, ductility, formability, and excellent fatigue resistance. However, impact-induced structural damage is a major concern and has not been previously characterized in PVA-ECC structures. We investigate the damage of PVA-ECC beams under low-velocity impact loading. A series of ball-drop impact tests were performed at different drop weights and heights to simulate various impact energies. The impact results of PVA-ECC beams were compared with mortar beams. A combination of polyvinylidene fluoride (PVDF) thin-film sensors and piezoceramic-based smart aggregate were used for impact monitoring, which included impact initiation and crack evolution. Short-time Fourier transform (STFT) of the signal received by PVDF thin-film sensors was performed to identify impact events, while active-sensing approach was utilized to detect impact-induced crack evolution by the attenuation of a propagated guided wave. Wavelet packet-based energy analysis was performed to quantify failure development under repeated impact tests.
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