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Intel Server Chassis SC5650

Technical Product Specification

E39531-002

Revision 1.0
January, 2009 Enterprise Platforms and Services Marketing

Intel Confidential

Revision History

Intel Server Chassis SC5650

Revision History
Date January, 2009 Revision Number 1.0 Initial release Modifications

Disclaimers
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. This document contains information on products in the design phase of development. Do not finalize a design with this information. Revised information will be published when the product is available. Verify with your local sales office that you have the latest datasheet before finalizing a design. The Intel Server Chassis SC5650 may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel Corporation server baseboards contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intels own chassis are designed and tested to meet the intended thermal requirements of these components when the fully integrated system is used together. It is the responsibility of the system integrator that chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of air flow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible if components fail or the server board does not operate correctly when used outside any of their published operating or non-operating limits. Intel, Pentium, Itanium, and Xeon are trademarks or registered trademarks of Intel Corporation. *Other brands and names may be claimed as the property of others. Copyright Intel Corporation 2009.

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Table of Contents

Table of Contents
1. Product Overview................................................................................................................. 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 2. 2.1 2.1.1 2.1.2 2.1.3 2.1.4 2.1.5 2.1.6 2.1.7 2.1.8 2.2 2.2.1 2.2.2 2.2.3 2.2.4 2.2.5 2.2.6 2.3 2.3.1 2.3.2 2.3.3 2.3.4 2.3.5
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Intel Server Chassis SC5650 Design Features ...................................................... 1 Chassis Views ......................................................................................................... 3 System Color ........................................................................................................... 7 Chassis Security ...................................................................................................... 7 I/O Panel.................................................................................................................. 7 Rack and Cabinet Mounting Option......................................................................... 7 Front Bezel Features ............................................................................................... 8 Peripheral Bays ....................................................................................................... 8 DP 600-Watt Power Supply ..................................................................................... 9 Mechanical Overview............................................................................................. 10 Airflow and Temperature ....................................................................................... 11 Output Cable Harness ........................................................................................... 11 AC Input Requirements ......................................................................................... 16 DC Output Specifications....................................................................................... 19 Protection Circuits.................................................................................................. 26 Current Limit (OCP) ............................................................................................. 26 FRU Data............................................................................................................... 30 600-W 1+1 Power Supply Module ......................................................................... 31 Mechanical Overview............................................................................................. 31 AC Input Requirements ......................................................................................... 33 DC Output Specification ........................................................................................ 38 Protection Circuits.................................................................................................. 46 Control and Indicator Functions............................................................................. 47 PMBus Monitoring Interface .................................................................................. 51 600-W Power Distribution Board (PDB)................................................................. 53 Mechanical Overview............................................................................................. 54 DC Output Specification ........................................................................................ 60 Protection Circuits.................................................................................................. 66 Control and Indicator Functions (Hard-wired)........................................................ 67 PMBus ................................................................................................................... 70
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Power Sub-system ............................................................................................................... 9

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2.4 2.4.1 2.4.2 2.4.3 2.4.4 2.4.5 2.4.6 2.4.7 2.4.8 2.4.9 3. 3.1 3.2 3.3 4. 4.1 4.2 4.3 4.3.1

1000-W Power Supply ........................................................................................... 71 Mechanical Overview............................................................................................. 72 Airflow Requirements............................................................................................. 74 Acoustic Requirements.......................................................................................... 74 Temperature Requirements ................................................................................... 74 AC Input Voltage Requirements ............................................................................ 75 DC Output Specification ........................................................................................ 81 Power Connectors ................................................................................................. 81 DC Output Specifications....................................................................................... 85 Control and Indicator Functions............................................................................. 94 Fan Configuration .................................................................................................. 97 Server Board Fan Control ...................................................................................... 97 Cooling Solution..................................................................................................... 98 3.5-inch Peripheral Drive Bay .............................................................................. 100 5.25-inch Peripheral Drive Bays .......................................................................... 101 Hot Swap Hard Disk Drive Bays .......................................................................... 101 Fixed Hard Drive Bay........................................................................................... 101

Chassis Cooling ................................................................................................................. 97

Peripheral and Hard Drive Support................................................................................. 100

4.3.2 Intel Server Chassis SC5650 6HDD Passive SAS/SATA Hot Swap Back Plane (HSBP) Overview ............................................................................................................... 102 4.3.3 4.3.4 4.3.5 4.3.6 4.3.7 4.3.8 4.3.9 4.3.10 4.3.11 4.3.12 4.3.13 4.3.14 4.3.15 5. Server Board and Storage Management Controller VSC410*............................. 103 General Purpose Input/Output (GPIO) ................................................................ 106 External Memory Device...................................................................................... 108 LEDs .................................................................................................................... 108 SAS/SATA Drive Connectors .............................................................................. 109 Power Connectors ............................................................................................... 109 Clock Generation and Distribution ....................................................................... 110 7-Pin SAS/SATA Host Connectors ...................................................................... 110 IPMB Header - IPMB ........................................................................................... 110 SGPIO Header - SGPIO ...................................................................................... 111 SES Header - SES .............................................................................................. 111 Passive Hot Swap Backplane (HSBP) Cables Explained.................................... 112 Connector Specifications ..................................................................................... 114

Standard Control Panel ................................................................................................... 115

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5.1 6. 7. 6.1 7.1 7.2 7.2.1 7.2.2 7.2.3 7.2.4 7.3 7.4 7.5 7.6 8. 9.

Control Panel ....................................................................................................... 115 Internal Control Panel Headers ........................................................................... 118 Signal Definitions ................................................................................................. 119 Chassis Internal Cables....................................................................................... 119 Control Panel Cable............................................................................................. 119 USB Cable ........................................................................................................... 119 Fan Connector ..................................................................................................... 119 Chassis Intrusion Cable....................................................................................... 119 Server Board Internal Cables .............................................................................. 119 Accessory Cables ................................................................................................ 120 I/O Panel Connectors .......................................................................................... 120 Spares and Accessories ...................................................................................... 120

Intel Local Control Panel................................................................................................ 117 System Interconnection................................................................................................... 119

Supported Intel Server Boards...................................................................................... 122 Regulatory, Environmentals, and Specifications .......................................................... 123 9.1 9.1.1 9.1.2 9.1.3 9.1.4 9.1.5 9.2 9.2.1 9.2.2 9.2.3 9.2.4 9.2.5 9.2.6 9.2.7 9.3 9.4 9.5 9.6 9.7 Product Regulatory Compliance .......................................................................... 123 Product Safety Compliance ................................................................................. 123 Product EMC Compliance Class A Compliance ............................................... 123 Product Ecology Requirements ........................................................................... 124 Certifications / Registrations / Declarations ......................................................... 124 Product Regulatory Compliance Markings .......................................................... 125 Electromagnetic Compatibility Notices ................................................................ 126 FCC Verification Statement (USA) ...................................................................... 126 ICES-003 (Canada) ............................................................................................. 127 Europe (CE Declaration of Conformity) ............................................................... 127 Japan EMC Compatibility .................................................................................... 127 BSMI (Taiwan) ..................................................................................................... 127 RRL (Korea)......................................................................................................... 128 CNCA (CCC-China) ............................................................................................. 128 Regulated Specified Components ....................................................................... 128 End of Life / Product Recycling............................................................................ 129 Restriction of Hazardous Substances (RoHS) Compliance................................. 129 Replacing the Back up Battery ............................................................................ 129 System-level Environmental Limits ...................................................................... 130
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9.8 9.9

Serviceability and Availability............................................................................... 131 Calculated MTBF ................................................................................................. 131

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List of Figures

List of Figures
Figure 1. Front Closed Chassis View of Intel Server Chassis SC5650...................................... 3 Figure 2. Rear Closed Chassis View of Intel Server Chassis SC5650 ...................................... 4 Figure 3. Front Internal Chassis View of Intel Server Chassis SC5650 (DP/WS/BRP configuration shown) .............................................................................................................. 5 Figure 4. Rear Internal Chassis View of Intel Server Chassis SC5650 with Optional Hot-swap Drive Bay................................................................................................................................ 6 Figure 5. ATX 2.2 I/O Aperture .................................................................................................... 7 Figure 6. Mechanical Drawing for Power Supply Enclosure ...................................................... 10 Figure 7. Output Cable Harness for 600-W Power Supply ........................................................ 12 Figure 8. Output Voltage Timing ................................................................................................ 24 Figure 9. Turn On/Off Timing (Power Supply Signals)............................................................... 26 Figure 10. PSON# Required Signal Characteristics .................................................................. 29 Figure 11. Power Supply Enclosure - Dimensional Drawing ..................................................... 31 Figure 12. Output Voltage Timing .............................................................................................. 43 Figure 13. Turn On/Off Timing (Power Supply Signals).............................................................. 45 Figure 14. Mechanical Drawing for Dual (1+1 Configuration) Power Supply Enclosure............ 55 Figure 15. Output Voltage Timing .............................................................................................. 64 Figure 16. Turn On/Off Timing (Power Supply Signals)............................................................. 65 Figure 17. Mechanical Drawing of the 1000-W Power Supply Enclosure.................................. 73 Figure 18. LED Markings ........................................................................................................... 75 Figure 19. Output Voltage Timing .............................................................................................. 90 Figure 20. Turn On/Off Timing (Power Supply Signals)............................................................. 92 Figure 21. Cooling Fan Configuration for Intel Server Boards S5520HC/S5500HCV/S5520SC above and S5500BC below................................................................................................. 98 Figure 22. Drive Bay Locations for Intel Server Chassis SC5650 (DP/WS/BRP configuration shown)................................................................................................................................ 100 Figure 23. 6HDD Passive SAS/SATA HSBP Block Diagram................................................... 103 Figure 24. Passive SAS/SATA HSBP I2C Bus Connection Diagram ....................................... 104 Figure 25. Intel Server Chassis SC5650 6HDD Passive SAS/SATA HSBP Board Layout .... 113 Figure 26. Panel Controls and Indicators................................................................................. 115 Figure 27. SKU3 - Pedestal Server Application ....................................................................... 117 Figure 28. Local Control Panel Components ........................................................................... 117

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List of Tables

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List of Tables
Table 1. Intel Server Chassis SC5650 DP, BRP, and WS Features.......................................... 2 Table 2. Thermal Environmental Requirements ........................................................................ 11 Table 3. Cable Lengths.............................................................................................................. 13 Table 4. P1 Baseboard Power Connector ................................................................................. 13 Table 5. P2 Processor 0 Power Connector................................................................................ 14 Table 6. P3 Processor 1 Power Connector................................................................................ 14 Table 7. P4 Power Singal Connectors ....................................................................................... 15 Table 8. P5-P8 Peripheral Power Connector............................................................................. 15 Table 9. P9 Right-angle SATA Power Connector ...................................................................... 16 Table 10. P10 SATA Power Connector ..................................................................................... 16 Table 11. AC Input Rating.......................................................................................................... 17 Table 12. AC Line Sag Transient Performance ......................................................................... 18 Table 13. AC Line Surge Transient Performance ...................................................................... 19 Table 14. Load Ratings.............................................................................................................. 20 Table 15. Voltage Regulation Limits .......................................................................................... 21 Table 16. Transient Load Requirements.................................................................................... 22 Table 17. Capacitive Loading Conditions .................................................................................. 22 Table 18. Ripple and Noise........................................................................................................ 23 Table 19. Output Voltage Timing ............................................................................................... 24 Table 20. Turn On / Off Timing .................................................................................................. 25 Table 21. Over Current Protection (OCP) .................................................................................. 27 Table 22. Over Voltage Protection Limits .................................................................................. 27 Table 23. PSON# Signal Characteristics ................................................................................... 28 Table 24. PWOK Signal Characteristics .................................................................................... 29 Table 25. Acoustic Requirements .............................................................................................. 32 Table 26. Thermal Requirements .............................................................................................. 33 Table 27. Efficiency.................................................................................................................... 34 Table 28. AC Input Rating.......................................................................................................... 34 Table 29. AC Line Sag Transient Performance ......................................................................... 35 Table 30. AC Line Surge Transient Performance ...................................................................... 35 Table 31. Performance Criteria.................................................................................................. 36 Table 32. Holdup Requirements ................................................................................................ 37

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Table 33. Edge Finger Power Supply Connector Pin-out .......................................................... 39 Table 34. Power Supply Module Load Ratings.......................................................................... 40 Table 35. Voltage Regulation Limits .......................................................................................... 41 Table 36. Transient Load Requirements.................................................................................... 41 Table 37. Capacitive Loading Conditions .................................................................................. 41 Table 38. Ripple and Noise........................................................................................................ 42 Table 39. Output Voltage Timing ............................................................................................... 43 Table 40. Turn On / Off Timing .................................................................................................. 44 Table 41. Over-current Protection (OCP) .................................................................................. 46 Table 42. Over-voltage Protection Limits................................................................................... 47 Table 43. PSON# Signal Characteristic..................................................................................... 48 Table 44. PSKILL Signal Characteristics .................................................................................. 48 Table 45. PWOK Signal Characteristics .................................................................................... 49 Table 46. LED Indicators ........................................................................................................... 51 Table 47. Environmental Requirements..................................................................................... 56 Table 48. Cable Lengths............................................................................................................ 56 Table 49. P1 Baseboard Power Connector ............................................................................... 57 Table 50. P2 Processor 0 Power Connector.............................................................................. 58 Table 51. P3 Processor 1 Power Connector.............................................................................. 58 Table 52. P5, P6, P7, and P8 Peripheral Power Connectors .................................................... 59 Table 53. P9 Right-angle SATA Power Connector .................................................................... 59 Table 54. P10 SATA Power Connector ..................................................................................... 60 Table 55. +12V Outputs Load Ratings....................................................................................... 60 Table 56. DC/DC Converters Load Ratings ............................................................................... 61 Table 57. Voltage Regulation Limits .......................................................................................... 61 Table 58. Transient Load Requirements.................................................................................... 62 Table 59. Capacitive Loading Conditions .................................................................................. 62 Table 60. Ripple and Noise........................................................................................................ 63 Table 61. Output Voltage Timing ............................................................................................... 63 Table 62. Turn On / Off Timing .................................................................................................. 64 Table 63. Over-current Protection Limits / 240VA Protection .................................................... 66 Table 64. Over-voltage Protection (OVP) Limits ........................................................................ 67 Table 65. PSON# Signal Characteristics ................................................................................... 68 Table 66. PWOK Signal Characteristics .................................................................................... 69 Table 67. SMBAlert# Signal Characteristics .............................................................................. 70
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Table 68. Sound Power Requirement........................................................................................ 74 Table 69. Thermal Requirements .............................................................................................. 74 Table 70. AC Input Rating.......................................................................................................... 75 Table 71. AC Line Sag Transient Performance ......................................................................... 76 Table 72. AC Line Surge Transient Performance ...................................................................... 76 Table 73. Performance Criteria.................................................................................................. 77 Table 74. AC Line Dropout / Holdup .......................................................................................... 78 Table 75. Efficiency.................................................................................................................... 80 Table 76. Cable Lengths............................................................................................................ 81 Table 77. P1 Baseboard Power Connector ............................................................................... 81 Table 78. P2 Processor 1 Power Connector.............................................................................. 82 Table 79. P3 Processor 2 Power Connector.............................................................................. 83 Table 80. P4 Power Signal Connector....................................................................................... 83 Table 81. P5 PCI Express Connector ........................................................................................ 83 Table 82. P6 PCI Express Connector ........................................................................................ 84 Table 83. P9-P12 Peripheral Power Connectors ....................................................................... 84 Table 84. P13 Right-angle SATA Power Connector .................................................................. 84 Table 85. P14 SATA Power Connector ..................................................................................... 85 Table 86. Load Ratings.............................................................................................................. 85 Table 87. Pre-set Lighter Load .................................................................................................. 86 Table 88. Pre-set Lighter Voltage Regulation Limits.................................................................. 86 Table 89. Voltage Regulation Limits .......................................................................................... 88 Table 90. Transient Load Requirements.................................................................................... 88 Table 91. Capacitive Loading Conditions .................................................................................. 89 Table 92. Ripple and Noise........................................................................................................ 89 Table 93. Output Voltage Timing ............................................................................................... 90 Table 94. Turn On / Off Timing .................................................................................................. 91 Table 95. Over-current Protection (OCP) 240VA....................................................................... 93 Table 96. Over-voltage Protection Limits................................................................................... 93 Table 97. PSON# Signal Characteristic..................................................................................... 94 Table 98. PWOK Signal Characteristics .................................................................................... 95 Table 99. LED Indicators ........................................................................................................... 95 Table 100. I2C Bus Addressing ................................................................................................ 105 Table 101. 6HDD I2C Bus Loading .......................................................................................... 105 Table 102. 6HDD VSC410* Controller GPIO Assignment ....................................................... 106

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Table 103. LED Function ......................................................................................................... 108 Table 104. 22-pin SAS/SATA Connector Pin-out .................................................................... 109 Table 105. Power Connector Pin-out....................................................................................... 110 Table 106. 7-pin SAS/SATA Connector Pin-out ...................................................................... 110 Table 107. IPMB Header Pin-out ............................................................................................. 111 Table 108. SGPIO Header Pin-out .......................................................................................... 111 Table 109. SES Header Pin-out............................................................................................... 111 Table 110. 6HDD Passive SAS/SATA Hot Swap Backplane Connector Specifications .......... 114 Table 111. Control Panel LED Functions................................................................................. 116 Table 112. IPMI Header........................................................................................................... 118 Table 113. System Office Environment Summary ................................................................... 130 Table 114. Mean Time To Repair Estimate ............................................................................. 131 Table 115. Intel Server Chassis SC5650 Component MTBF................................................. 132

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Product Overview

1.

Product Overview

The Intel Server Chassis SC5650 is a 5.2U pedestal chassis designed to support the Intel Server Boards S5500BC, S5520HC/S5500HCV, and S5520SC. This chapter provides a highlevel overview of the chassis features. Greater detail for each major chassis component or feature is provided in the following chapters.

1.1

Intel Server Chassis SC5650 Design Features

The Intel Server Chassis SC5650 addresses the value server market with three power factor correction (PFC) power supply unit (PSU) configurations: SC5650DP 600-W fixed PSU for dual-processor server boards SC5650WS 1000-W fixed PSU for dual-processor workstation boards SC5650BRP 600-W 1+0 redundant PSU for dual-processor server boards The DP and WS power supply configurations each include an Intel validated PSU with an integrated cooling fan and one AC line input. The BRP power supply configuration includes (1 of 2) redundant Intel validated PSU (full redundancy requires an additional 600-W module) with an integrated cooling fan and two AC line inputs. The cooling sub-system in the Intel Server Chassis SC5650 consists of one 120-mm system fan, one 120-mm PCI fan and a 92-mm drive bay fan. A 92-mm drive bay fan is also included with the optional hot swap drive bay mounting bracket kit. A removable access cover provides entry to the interior of the chassis. The rear I/O panel conforms to the Advanced Technology Extended (ATX) Specification, Revision 2.2. The chassis supports six full-length expansion cards. There are two front USB port connections, and one rear knock-out location for an optional rear mounted serial port. A control panel board designed for Server Standards Infrastructure (SSI) Entry E-Bay (EEB) 3.61-compliant server boards is also provided with the server chassis. The Intel Server Chassis SC5650 supports up to six hard drives in all three configurations. Two 5.25-inch, half-height drive bays are available for peripherals, such as CD/DVD-ROM drives and tape drives. An optional hot-swap SAS non-expander/SAS expander drive bay kit provides an upgrade path to allow the Intel Server Chassis SC5650 to support up to six hot-swap drives. Refer to the Drive Cage Upgrade Kit Installation Guide for the Intel Server Chassis SC5650 for complete hot swap drive cage installation instructions. When installed, the hot-swap drive bay replaces the fixed hard drive bay. The Intel Server Chassis SC5650 makes extensive use of tool-less hardware features that support tool-less installation and removal of fans, fixed and hot swap hard drives, fixed and hot swap drive bays, PCI cards, hot swap PSU modules, fixed PSU, floppy drives, and CD/DVD ROM drives. This specification details the key features of the product. Reference documents listed at the back of this document provide additional product specification details for the server boards, backplanes, and power supplies validated for use with this chassis. Check the compatibility

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section on the support website for more details: http://support.intel.com/support/motherboards/server/chassis/SC5650/. The following table summarizes the features for all chassis combinations.
Table 1. Intel Server Chassis SC5650 DP, BRP, and WS Features
Configuration Intel Server Board Support

SC5650DP Intel Server Board S5500BC Intel Server Board S5520HC/ Intel Server Board S5500HCV

SC5650BRP Intel Server Board S5500BC Intel Server Board S5520HC/ Intel Server Board S5500HCV 600-W PFC Intel validated PSU with integrated cooling fan. You can add one additional 600-W PSU for redundancy.

SC5650WS Intel Server Board S5520SC

Power Delivery

600-W PFC Intel validated PSU with integrated cooling fan.

1000-W PFC Intel validated PSU with integrated cooling fan.

System Cooling Peripheral Bays Drive Bays PCI Slots Form Factor Front Panel

One tool-less, 120-mm chassis fan. One tool-less 120-mm PCI fan. One tool-less 92-mm drive bay fan. Two tool-less, multi-mount 5.25-inch peripheral bays. One standard 3.5-inch removable media peripheral bay. Includes one tool-less fixed drive bay for up to six fixed drives. Seven slots, six full-length, full-height PCI slots with tail card guide and one half length PCI slot. 5.2U tower, convertible to 6U rack mount. LEDs for NIC1, NIC2, HDD activity, power status, and system fault status. Switches for power, NMI, and reset. Integrated temperature sensor for fan speed management.

External Front Connectors Color Construction Chassis ABS Dimensions Pedestal Dimensions Rack

Two USB ports Black 1.0-mm, zinc-plated sheet metal, meets Intel Cosmetic Spec # C25432 Fire-retardant, non-brominated, PC-ABS 17.8 in (45.2 cm) x 9.256 in (23.5 cm) x 19 in (48.3 cm) 9.256 in (23.5 cm) x 17.6 in (44.7 cm) x 19 in (48.3 cm)

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1.2

Chassis Views

A. B. C. D. E.

Control panel controls and indicators Two half-height 5.25-inch peripheral drive bays Internal hard drive bay cage (behind door) Security lock USB ports

Figure 1. Front Closed Chassis View of Intel Server Chassis SC5650

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A. B. C. D. E. F. G. H. I. J.

Power supply (fixed power supply shown) AC input power connector I/O Ports Expansion slot covers Alternate external SCSI knockout 120-mm system fan Serial B port knockout Location to install padlock loop External SCSI knockout Alternate Serial B port knockout

Figure 2. Rear Closed Chassis View of Intel Server Chassis SC5650

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Product Overview

Figure 3. Front Internal Chassis View of Intel Server Chassis SC5650 (DP/WS/BRP configuration shown)

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Figure 4. Rear Internal Chassis View of Intel Server Chassis SC5650 with Optional Hot-swap Drive Bay

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1.3

System Color
Black (GE701)

The Intel Server Chassis SC5650 is offered in one color:

1.4

Chassis Security
A removable padlock loop at the rear of the system access cover can be used to prevent access to the microprocessors, memory, and add-in cards. A variety of lock sizes can be accommodated by the 0.270-inch diameter loop. A two-position key lock/switch will unlock the front bezel for DP, WS, and BRP configurations. A chassis intrusion switch is provided, allowing server management software to detect unauthorized access to the system side cover.

A variety of chassis security options are provided at the system level:

Note: See the technical product specification appropriate to the server board for a description of BIOS and management security features for each specific supported platform. You can find technical product specifications at: http://support.intel.com.

1.5

I/O Panel

All input/output (I/O) connectors are accessible from the rear of the chassis. The SSI E-bay 3.61-compliant chassis provides an ATX 2.2-compatible cutout for I/O shield installation. Boxed Intel server boards provide the required I/O shield for installation in the cutout. The I/O cutout dimensions are shown in the following figure for reference.
R 0.039 MAX, TYP 0.100 Min keepout around opening

1.750 0.008

I/O Aperture

Baseboard

Datum 0,0

(0.150)

6.250 0.008

5.196 0.010

(0.650)

Figure 5. ATX 2.2 I/O Aperture

1.6

Rack and Cabinet Mounting Option

The Intel Server Chassis SC5650 supports a rack mount configuration. The rack mount kit includes the chassis slide rails, rack handle, rack orientation label, screws, and manual. This rack mount kit is designed to meet the EIA-310-D enclosure specification. General rack compatibility is further described in the Server Rack Cabinet Compatibility Guide found at http://support.intel.com.

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1.7

Front Bezel Features

The bezel is constructed of molded plastic and attaches to the front of the chassis with three clips on the right side and two snaps on the left. The snaps at the left attach behind the access cover, thereby preventing accidental removal of the bezel. The bezel can only be removed by first removing the server access cover. This provides additional security to the hard drive and peripheral bay area. The bezel also includes a key-locking door that covers the drive cage area and allows access to hot swap drives when a hot swap drive bay is installed. The peripheral bays are covered with plastic snap-in cosmetic pieces that must be removed to add peripherals to the system. Control panel buttons and lights are located along the right side of the peripheral bays.

1.8

Peripheral Bays

Two 5.25-inch, half-height drive bays are available for CD/DVD-ROM or tape drives as well as one 3.5-inch removable media drive bay. Drive installation is tool-less and requires no screws.

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Power Sub-system

2.
2.1

Power Sub-system
DP 600-Watt Power Supply

The 600-W power supply specification defines a non-redundant power supply that supports DP Intel Xeon rack mount server systems. The 600-W power supply has eight outputs: 3.3V, 5V, 12V1, 12V2, 12V3, 12V4, -12V, and 5VSB. The form factor fits into a pedestal system and provides a wire harness output to the system. An IEC connector is provided on the external face for AC input to the power supply. The power supply incorporates a Power Factor Correction circuit. The power supply is tested as described in EN 61000-3-2: Electromagnetic Compatibility (EMC) Part 3: Limits-Section 2: Limits for Harmonic Current Emissions, and meets the harmonic current emissions limits specified for ITE equipment. The power supply is tested as described in the JEIDA MITI Guideline for Suppression of High Harmonics in Appliances and General-Use Equipment and meets the harmonic current emissions limits specified for ITE equipment.

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2.1.1

Mechanical Overview

Figure 6. Mechanical Drawing for Power Supply Enclosure

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2.1.2

Airflow and Temperature

The power supply incorporates one 80-mm fan for self and system cooling. The fan provides no less than 14 CFM of airflow through the power supply when installed in the system. The cooling air enters the power module from the non-AC side. The power supply operates within all specified limits over the Top temperature range.
Table 2. Thermal Environmental Requirements ITEM Top Tnon-op Altitude DESCRIPTION Operating temperature range. Non-operating temperature range. Maximum operating altitude 0 -40 MIN 50 70 1500 Specification UNITS C C m

The power supply meets UL enclosure requirements for temperature rise limits. With the exception of the air exhaust side, all sides of the power supply are classified as Handle, knobs, grips, etc. held for short periods of time only.

2.1.3

Output Cable Harness

Listed or recognized component appliance wiring material (AVLV2), CN, rated min 105C, 300Vdc is used for all output wiring.

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Figure 7. Output Cable Harness for 600-W Power Supply


NOTES: 1. ALL DIMENSIONS ARE IN MM 2. ALL TOLERANCES ARE +10 MM / -0 MM 3. INSTALL 1 TIE WRAP WITHIN 12MM OF THE PSU CAGE 4. MARK REFERENCE DESIGNATOR ON EACH CONNECTOR 5. TIE WRAP EACH HARNESS AT APPROX. MID POINT 6. TIE WRAP P1 WITH 2 TIES AT APPROXIMATELY 15M SPACING.

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Power Sub-system

Table 3. Cable Lengths To Connector # P1 To Connector # P2 P3 P4 P5 P6 P7 P8 P9 P10 Length (mm) 850 Length (mm) 400 400 350 350 100 800 75 800 75 Number of Pins 24 Number of Pins 8 8 5 4 4 4 4 5 5

From Power Supply cover exit hole From Power Supply cover exit hole Power Supply cover exit hole Power Supply cover exit hole Power Supply cover exit hole Extension Power Supply cover exit hole Extension Power Supply cover exit hole Extension

Description

Baseboard Power Connector

Description Processor 0 Power Connector Processor 1 Power Connector Power PSMI Connector Peripheral Power Connector Peripheral Power Connector Peripheral Power Connector Peripheral Power Connector Right-angle SATA Power Connector SATA Power Connector

2.1.3.1

P1 Baseboard Power Connector

Connector housing: 24-pin Molex* Mini-Fit Jr. 39-01-2245 or equivalent Contact: Molex* 39-00-0059, or equivalent; Molex* 44476-1111 for P10 & P11
Table 4. P1 Baseboard Power Connector Pin 1 2 3 Revision 1.0 Signal +3.3 VDC +3.3 VDC COM 18 AWG Color Orange Orange Black Pin 13 14 15 Signal +3.3 VDC -12 VDC COM 18 AWG Color Orange Blue Black 13

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Pin 4 5 6 7 8 9 10 11 12

Signal +5 VDC COM +5 VDC COM PWR OK 5VSB +12V3 +12V2 +3.3 VDC

18 AWG Color Red Black Red Black Gray Purple Yellow Yellow Orange

Pin 16 17 18 19 20 21 22 23 24

Signal PSON# COM COM COM Reserved +5 VDC +5 VDC +5 VDC COM

18 AWG Color Green Black Black Black N.C. Red Red Red Black

2.1.3.2

P2 Processor 0 Power Connector

Connector housing: 8-pin Molex* 39-01-2085 or equivalent Contact: Molex* 39-00-0059 or equivalent
Table 5. P2 Processor 0 Power Connector Pin 1 2 3 4 Signal COM COM COM COM 18 AWG Color Black Black Black Black Pin 5 6 7 8 Signal +12V1 +12V1 +12V1 +12V1 18 AWG Color White White Brown Brown

2.1.3.3

P3 Processor 1 Power Connector

Connector housing: 8-pin Molex* 39-01-2085 or equivalent Contact: Molex* 39-00-0059 or equivalent
Table 6. P3 Processor 1 Power Connector Pin 1 2 3 Signal COM COM COM 18 AWG Color Black Black Black Pin 5 6 7 Signal +12V1 +12V1 +12V1 18 AWG Color Brown Brown White

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COM

Black

+12V1

White

2.1.3.4

P4 Power Signal Connectors

Connector housing: 5-pin Molex* 50-57-9405 or equivalent Contacts: Molex* 16-02-0087 or equivalent
Table 7. P4 Power Singal Connectors Pin 1 2 3 4 5
2

Signal I C Clock I2C Data Reserved COM 3.3RS

24 AWG Color White Yellow N.C. Black Orange

2.1.3.5

P5-P8 Peripheral Power Connector

Connector housing: AMP* 770827-1 or equivalent Contact: AMP* 61117-4, or equivalent


Table 8. P5-P8 Peripheral Power Connector Pin 1 2 3 4 Signal +12V4 COM COM +5Vdc 18 AWG Color Blue/White Stripe Black Black RED

2.1.3.6

P9 Right-angle SATA Power Connector

Connector Housing: JWT* F6002HS0-5P-18 or equivalent Contact: N/A

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Table 9. P9 Right-angle SATA Power Connector Pin 1 2 3 4 5 Signal +3.3V Ground +5V Ground +12V4 18 AWG Color Orange Black Red Black Green

2.1.3.7

P10 SATA Power Connector

Connector Housing: 5-pin Molex* 67926-0011 or equivalent Contact: Molex* 67926-0041 or equivalent
Table 10. P10 SATA Power Connector Pin 1 2 3 4 5 Signal +3.3V COM +5V COM +12V2 18 AWG Color Orange Black Red Black Blue/White

2.1.4

AC Input Requirements

The power supply operates within all specified limits over the following input voltage range, shown in the following table. Harmonic distortion of up to 10% of the rated line voltage must not cause the power supply to go out of specified limits. If the AC input is less than 75VAC +/-5VAC range, the power supply does power off. If the AC input is greater than 85VAC +/-4VAC, the power supply starts up. Application of an input voltage below 85VAC does not cause damage to the power supply, including a fuse blow.

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Table 11. AC Input Rating PARAMETER Voltage (110) Voltage (220) Frequency MIN 90 Vrms 180 Vrms 47 Hz Rated 100-127 Vrms 200-240 Vrms 50/60Hz MAX 140 Vrms 264 Vrms 63 Hz Max Input Current 10 A1,3 5 A2,3 Start up VAC 85Vac +/4Vac Power Off VAC 75Vac +/5Vac

Notes: 1 Maximum input current at low input voltage range should measured at 90VAC, at max load. 2 Maximum input current at high input voltage range should be measured at 180VAC, at max load. 3 Do not use this requirement for determining agency input current markings.

2.1.4.1

AC Inlet Connector

The AC input connector is an IEC 320 C-14 power inlet. This inlet is rated for 10A / 250VAC. 2.1.4.2 Efficiency

The power supply has a recommended efficiency of 68% at maximum load and over the specified AC voltage. 2.1.4.3 AC Line Dropout / Holdup

An AC line dropout is defined to be when the AC input drops to 0VAC at any phase of the AC line for any length of time. During an AC dropout of one cycle or less the power supply meets dynamic voltage regulation requirements over the rated load. An AC line dropout of one cycle or less (20ms min) does not cause any tripping of control signals or protection circuits. If the AC dropout lasts longer than one cycle, the power recovers and meets all turn-on requirements. The power supply meets the AC dropout requirement over rated AC voltages, frequencies, and output loading conditions. Any dropout of the AC line does not cause damage to the power supply. 2.1.4.3.1 AC Line 5VSB Holdup

The 5VSB output voltage stays in regulation under its full load (static or dynamic) during an AC dropout of 70ms min (=5VSB holdup time) whether the power supply is in the ON or OFF state (PSON asserted or de-asserted). 2.1.4.4 AC Line Fuse

The power supply has a single line fuse on the Line (Hot) wire of the AC input. The line fusing is acceptable for all safety agency requirements. The input fuse is a slow blow type. AC inrush current does not cause the AC line fuse to blow under any conditions. All protection circuits in the power supply do not cause the AC fuse to blow unless a component in the power supply failed. This includes DC output load short conditions.
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2.1.4.5

AC In-rush

AC line in-rush current does not exceed a 50 A peak, cold start @ 20 degrees C and no damage at hot start for up to one-quarter of the AC cycle, after which, the input current is no more than the specified maximum input current at 264 Vac input. The peak in-rush current is less than the ratings of its critical components (including input fuse, bulk rectifiers, and surge limiting device). The power supply meets the in-rush requirements for any rated AC voltage during turn on at any phase of AC voltage, during a single cycle AC dropout condition as well as upon recovery after AC dropout of any duration, and over the specified temperature range (Top). 2.1.4.6 AC Line Surge

The power supply is tested with the system for immunity to AC Ringwave and AC Unidirectional wave, both up to 2kV, per EN 55024:1998, EN 61000-4-5:1995 and ANSI C62.45: 1992. Pass criteria includes: No unsafe operation allowed under any conditions; all power supply output voltage levels must stay within proper specification levels; no change in operating state or loss of data during and after the test profile; no component damage under any conditions. 2.1.4.7 AC Line Transient Specification

AC line transient conditions are defined as sag and surge conditions. Sag conditions are also commonly referred to as brownout, and defined as AC line voltage drops below nominal voltage conditions. Surge is defined as AC line voltage rises above nominal voltage conditions. The power supply meets requirements under the following AC line sag and surge conditions.
Table 12. AC Line Sag Transient Performance Duration Continuous 0 to 1 AC cycle > 1 AC cycle Sag 10% 95% >30% Operating AC Voltage Nominal AC Voltage ranges Nominal AC Voltage ranges Nominal AC Voltage ranges Line Frequency 50/60Hz 50/60Hz 50/60Hz Performance Criteria No loss of function or performance No loss of function or performance Loss of function acceptable, self recoverable

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Table 13. AC Line Surge Transient Performance Duration Continuous 0 to AC cycle Surge 10% 30% Operating AC Voltage Nominal AC Voltages Mid-point of nominal AC Voltages Line Frequency 50/60Hz 50/60Hz Performance Criteria No loss of function or performance No loss of function or performance

2.1.4.8

AC Line Fast Transient (EFT) Specification

The power supply meets the EN 61000-4-5 directive and any additional requirements in IEC1000-4-5:1995 and the Level 3 requirements for surge-withstand capability with the following conditions and exceptions: These input transients do not cause any out-of-regulation conditions, such as overshoot and undershoot, nor do they cause any nuisance trips of any of the power supply protection circuits. The surge-withstand test does not produce damage to the power supply. The power supply meets surge-withstand test conditions under maximum and minimum DC-output load conditions. AC Line Leakage Current

2.1.4.9

The maximum leakage current to ground for each power supply is 3.5 mA when tested at 240 VAC.

2.1.5
2.1.5.1

DC Output Specifications
Grounding

The ground of the pins of the power supply output connector provides the power return path. The output connector ground pins are connected to the safety ground (power supply enclosure). 2.1.5.2 Standby Output

The 5 VSB output is present when an AC input greater than the power supply turn-on voltage is applied. 2.1.5.3 Fanless Operation

Fanless operation is the power supplys ability to work indefinitely in standby mode with power on, power supply off, and the 5 VSB at full load (=2A) under environmental conditions
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(temperature, humidity, and altitude). In this mode, the components maximum temperature should follow the same guidelines. 2.1.5.4 Remote Sense

The power supply has remote sense return (ReturnS) to regulate out ground drops for all output voltages: +3.3V, +5V, +12V1, +12V2, +12V3, +12V4, -12V, and 5VSB. The power supply uses remote sense to regulate out drops in the system for the +3.3V, +5V, and +12V1 output. The +5V, +12V1, +12V2, +12V3, +12V4, 12V, and 5VSB outputs only use remote sense referenced to the ReturnS signal. The remote sense input impedance to the power supply is greater than 200. This is the value of the resistor connecting the remote sense to the output voltage internal to the power supply. Remote sense can regulate out a minimum of 200mV drop. The remote sense return (ReturnS) can regulate out a minimum of 200 mV drop in the power ground return. The current in any remote sense line is less than 5mA to prevent voltage sensing errors. The power supply operates within specification over the full range of voltage drops from the power supplys output connector to the remote sense points. 2.1.5.5 Power Module Output Power / Currents

The following table defines power and current ratings for this 600-W power supply. The combined output power of all outputs does not exceed the rated output power. The following are load ranges for each of the two power supply power levels. The power supply meets both static and dynamic voltage regulation requirements for the minimum loading conditions.
Table 14. Load Ratings

Load Range 1 (Maximum System Loading) Minimum Continuous Load 1.5 A 5.0 A 1.5 A 1.5 A 1.5 A 1.5 A 0A 0.1 A Maximum Continuous Load1, 3 20 A 24 A 15 A 15 A 16 A 16 A 0.5 A 2.0 A 18 A 18 A 18 A 18 A

Voltage +3.3V6 +5V6 +12V1 +12V2 +12V3 +12V4 -12V +5VSB

Peak Load2, 4, 5

Load Range 2 (Light System Loading)

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Voltage +3.3V6 +5V6 +12V1 +12V2 +12V3 +12V4 -12V +5VSB

Minimum Continuous Load 0.5 A 2.0 A 0.5 A 0.5 A 2.0 A 0.5 A 0A 0.1 A

Maximum Continuous Load 9.0 A 7.0 A 5.0 A 5.0 A 6.0 A 5.0 A 0.5 A 2.0 A

Peak Load5

7.0 A 7.0 A

Notes:
1. 2. 3. 4. 5. 6. Maximum continuous total DC output power should not exceed 600 W. Peak load on the combined 12-V output should not exceed 48 A. Maximum continuous load on the combined 12-V output should not exceed 43 A. Peak total DC output power should not exceed 660 W. Peak power and peak current loading should be supported for a minimum of 12 seconds. Combined 3.3 V/5 V power should not exceed 140 W.

2.1.5.6

Voltage Regulation

The power supply output voltages are within the following voltage limits when operating at steady state and dynamic loading conditions. These limits include the peak-peak ripple/noise. All outputs are measured with reference to the return remote sense signal (ReturnS). The +12V3, +12V4, 12V, and 5VSB outputs are measured at the power supply connectors referenced to ReturnS. The +3.3V, +5V, +12V1, and +12V2 are measured at the remote sense signal located at the signal connector.
Table 15. Voltage Regulation Limits Parameter + 3.3V + 5V + 12V1 + 12V2 +12V3 +12V4 Tolerance - 5% / +5% - 5% / +5% - 5% / +5% - 5% / +5% - 5% / +5% - 5% / +5% MIN +3.14 +4.75 +11.40 +11.40 +11.40 +11.40 NOM +3.30 +5.00 +12.00 +12.00 +12.00 +12.00 MAX +3.46 +5.25 +12.60 +12.60 +12.60 +12.60 Units Vrms Vrms Vrms Vrms Vrms Vrms

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- 12V + 5VSB

- 5% / +9% - 5% / +5%

-11.40 +4.75

-12.00 +5.00

-13.08 +5.25

Vrms Vrms

2.1.5.7

Dynamic Loading

The output voltages are within the limits specified for the step loading and capacitive loading requirements specified in the following table. The load transient repetition rate is tested between 50 Hz and 5 kHz at duty cycles ranging from 10%-90%. The load transient repetition rate is only a test specification. The step load may occur anywhere within the MIN load and MAX load conditions.
Table 16. Transient Load Requirements Output +3.3 V +5 V +12 V +5 VSB Step Load Size 1, 2 7.0 A 7.0 A 25 A 0.5 A Load Slew Rate 0.25 A/sec 0.25 A/sec 0.25 A/sec 0.25 A/sec Test Capacitive Load 4700 F 1000 F 2700 F 20 F

2.1.5.8

Capacitive Loading

The power supply is stable and meets all requirements with the following capacitive loading ranges.
Table 17. Capacitive Loading Conditions Output +3.3V +5V +12V(1, 2, 3) +12V4 -12V +5VSB MIN 10 10 500 each 10 1 20 MAX 12,000 12,000 11,000 500 350 350 Units F F F F F F

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2.1.5.9

Closed Loop Stability

The power supply is unconditionally stable under all line/load/transient load conditions including capacitive load ranges in Section 2.1.5.8. A minimum of a 45-degree phase margin and -10dBgain margin is required. Closed-loop stability is ensured at the maximum and minimum loads as applicable. 2.1.5.10 Residual Voltage Immunity in Standby Mode

The power supply is immune to any residual voltage placed on its outputs (typically a leakage voltage through the system from standby output) up to 500mV. There is neither additional heat generated nor stressing of any internal components with this voltage applied to any individual output or all outputs simultaneously. Residual voltage also does not trip the protection circuits during turn on/off. The residual voltage at the power supply outputs for a no-load condition does not exceed 100 mV when AC voltage is applied. 2.1.5.11 Common Mode Noise

The Common Mode noise on any output does not exceed 350mV pk-pk over the frequency band of 10Hz to 30MHz.The measurement is made across a 100 resistor between each of the DC outputs including ground at the DC power connector and chassis ground (power subsystem enclosure). The test set-up uses an FET probe, such as a Tektronix* P6046, or equivalent. 2.1.5.12 Ripple / Noise

The maximum allowed ripple/noise output of the power supply is defined in the following table. This is measured over a bandwidth of 10 Hz to 20 MHz at the power supply output connectors. A 10F tantalum capacitor in parallel with a 0.1F ceramic capacitor is placed at the point of measurement.
Table 18. Ripple and Noise +3.3V 50mVp-p +5V 50mVp-p +12V(1,2,3,4) 120mVp-p -12V 120mVp-p +5VSB 50mVp-p

2.1.5.13

Timing Requirements

The timing requirements for power supply operation are as follows. The output voltages must rise from 10% to within regulation limits (Tvout_rise) within 5 to 70ms, except for 5VSB which is allowed to rise from 1.0 to 25ms. The +3.3V, +5V and +12V output voltages start to rise at approximately the same time. All outputs must rise monotonically. The 5V output must be greater than the +3.3V output during any point of the voltage rise. The +5V output must never be greater than the +3.3V output by more than 2.25V. Each output voltage reaches regulation within 50 ms (Tvout_on) of each other during turn on of the power supply. Each output voltage falls out of regulation within 400msec (Tvout_off) of each other during turn off. The following table
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shows the timing requirements for the power supply being turned on and off via the AC input with PSON held low and the PSON signal with the AC input applied.
Table 19. Output Voltage Timing Item Tvout_rise Tvout_on T vout_off Description Output voltage rise time from each main output. All main outputs must be within regulation of each other within this time. All main outputs must leave regulation within this time. Minimum 5.0* Maximum 70* 50 400 Units msec msec msec

* The 5VSB output voltage rise time should be from 1.0 ms to 25 ms.

Vout

V1

10% Vout

V2

V3

V4

Tvout

rise

Tvout_off

Tvout_on

Figure 8. Output Voltage Timing

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Table 20. Turn On / Off Timing Item Tsb_on_delay Tac_on_delay Tvout_holdup Tpwok_holdup Tpson_on_delay Tpson_pwok Tpwok_on Tpwok_off Tpwok_low Tsb_vout T5VSB_holdup Description
Delay from AC being applied to 5VSB being within regulation. Delay from AC being applied to all output voltages being within regulation. Time all output voltages stay within regulation after loss of AC. Delay from loss of AC to de-assertion of PWOK. Delay from PSON active to output voltages within regulation limits. Delay from PSON deactive to PWOK being de-asserted. Delay from output voltages within regulation limits to PWOK asserted at turn on. Delay from PWOK de-asserted to output voltages (3.3 V, 5 V, 12 V, and -12 V) dropping out of regulation limits. Duration of PWOK being in the de-asserted state during an off/on cycle using AC or the PSON signal. Delay from 5 VSB being in regulation to O/Ps being in regulation at AC turn on. Time the 5 VSB output voltage stays within regulation after loss of AC. 100
# #

Minimum

Maximum
1500 2500

Units
msec msec msec msec

21 20 5 400 50 1000

msec msec msec

200

msec

100

msec

50

1000

msec

70

msec

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AC Input

Tvout_holdup

Vout

TAC_on_delay Tsb_on_delay PWOK Tpwok_on Tpwok_holdup Tpwok_off

Tpwok_low Tsb_on_delay Tpwok_on Tpwok_off Tpson_pwok

5VSB

Tsb_vout

T5VSB_holdup
Tpson_on_delay

PSON

AC turn on/off cycle

PSON turn on/off cycle

Figure 9. Turn On/Off Timing (Power Supply Signals)

2.1.6

Protection Circuits

Protection circuits inside the power supply cause only the power supplys main outputs to shut down. If the power supply latches off due to a protection circuit tripping, an AC cycle OFF for 15 seconds and a PSON# cycle HIGH for 1 second resets the power supply.

2.1.7

Current Limit (OCP)

The power supply has a current limit to prevent the +3.3V, +5V, and +12V outputs from exceeding the values shown in the following table. If the current limits are exceeded, the power supply shuts down and latches off. The latch is cleared by either toggling the PSON# signal or by an AC power interruption. The power supply is not damaged from repeated power cycling in this condition. -12 V and 5 VSB are protected under over current or shorted conditions so no damage occurs to the power supply. 5 VSB will auto-recover after the OCP limit is removed.

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Table 21. Over Current Protection (OCP)

VOLTAGE Min +3.3 V +5 V +12 V1 +12 V2 +12 V3 +12 V4 -12 V 5 VSB 26.4 A 26.4 A 18 A 18 A 18 A 18 A 0.625 A N/A

OVER CURRENT LIMIT Max 36 A 36 A 20 A 20 A 20 A 20 A 4A 8A

2.1.7.1

Over Voltage Protection (OVP)

The power supply over voltage protection is locally sensed. After an over-voltage condition occurs, the power supply shuts down and latches off. You can clear this latch by toggling the PSON# signal or by an AC power interruption. The following table contains the over voltage limits. The values are measured at the output of the power supplys pins. The voltage never exceeds the maximum levels when measured at the power pins of the power supply connector during any single point of fail. The voltage will not trip any lower than the minimum levels when measured at the power pins of the power supply connector. After the OVP condition is removed, +5 VSB will auto-recover.
Table 22. Over Voltage Protection Limits Output Voltage +3.3 V +5 V +12 V1,2,3,4 -12 V +5 VSB MIN (V) 3.9 V 5.7 V 13.3 V -13.3 V 5.7 V MAX (V) 4.5 V 6.5 V 14.5 V -16 V 6.5 V

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2.1.7.2

Over Temperature Protection (OTP)

The power supply is protected against over temperature conditions caused by loss of fan cooling or excessive ambient temperature. In an OTP condition, the power supply shuts down. When the power supply temperature drops to within specified limits, the power supply restores power automatically, while the 5 VSB will always remain on. The OTP circuit has a built-in hysteresis such that the power supply will not oscillate on and off due to a temperature recovering condition. The OTP trip level has a minimum of 4C of ambient temperature hysteresis. 2.1.7.3
#

PSON# Input Signal

The PSON signal is required to remotely turn on/off the power supply. PSON# is an active low signal that turns on the +3.3V, +5V, +12V, and -12V power rails. When this signal is not pulled low by the system or left open, the outputs (except the +5VSB) turn off. This signal is pulled to a standby voltage by a pull-up resistor internal to the power supply. Refer to the following table and figure for PSON# signal characteristics.
Table 23. PSON# Signal Characteristics Signal Type PSON# = Low PSON# = High or Open MIN Logic level low (power supply ON) Logic level high (power supply OFF) Source current, Vpson = low Power up delay: PWOK delay: Tpson_on_delay T pson_pwok 5 msec 0V 2.1V Accepts an open collector/drain input from the system. Pull-up to 5 V located in power supply. ON OFF MAX 1.0V 5.25V 4mA 400 msec 50 msec

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Figure 10. PSON# Required Signal Characteristics

Disabled

0.3V Hysterisis 1.0V In 1.0-2.0V input voltages range is required

1.0 V PS is enabled

2.0 V PS is disabled

Enabled 0V 1.0V 2.0V 5.25V

2.1.7.4

PWOK (Power OK) Output Signal

PWOK is a power OK signal and is pulled HIGH by the power supply to indicate all the outputs are within the regulation limits of the power supply. When any output voltage falls below regulation limits or when AC power is removed for a time sufficiently long so the power supply operation is no longer guaranteed, PWOK is de-asserted to a LOW state. The start of the PWOK delay time is inhibited as long as any power supply output is within current limit.
Table 24. PWOK Signal Characteristics Signal Type Open collector/drain output from power supply. Pull-up to VSB located in system. Power OK Power Not OK MIN Logic level low voltage, Isink=4mA Logic level high voltage, Isource=200A Sink current, PWOK = low Source current, PWOK = high PWOK delay: Tpwok_on PWOK rise and fall time Power down delay: T pwok_off 1 ms 100 ms 0V 2.4 V MAX 0.4 V 5.25 V 4m A 2m A 1000 ms 100sec 200 msec

PWOK = High PWOK = Low

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2.1.8

FRU Data

The FRU data format is compliant with the IPMI, version 1.0 (per rev.1.1 from Sept.25, 1999) specification. The current version of these specifications is available at: http://developer.intel.com/design/servers/ipmi/spec.htm. 2.1.8.1 Device Address Locations

The power supply device address location is as follows:


Power Supply FRU Device A0h

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2.2

600-W 1+1 Power Supply Module

The 600-W power supply module specification defines a 1+1 power supply module that supports pedestal server systems. It defines a 600-W power supply with 2 outputs: +12Vdc and +5Vsb. A separate cage (including power distribution board) is designed to plug directly to the output connector of the PS module and provide additional power converters to produce other required voltages. An IEC connector is provided on the external face for AC input to the power supply. The power supply contains cooling fans, while meeting acoustic requirements.

2.2.1

Mechanical Overview

The 1+1 configuration of 600-W power supply enclosure dimensional drawing is shown:

Figure 11. Power Supply Enclosure - Dimensional Drawing

2.2.1.1

Handle and Retention Mechanism

The power supply has a handle to provide a place to grip the power supply for removal and insertion. The power supply has a simple retention mechanism to retain the power supply once it is inserted. This mechanism withstands the specified mechanical shock and vibration
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requirements. The tab on the retention mechanism is green to indicate it is a hot-swap touch point. The latch mechanism is designed in such a way as to prevent inserting the power supply with the power cord plugged in. This aid in the hot swapping procedure: on removal, the power cord is unplugged first, then the power supply is removed; on insertion, the power supply is inserted first and then the power cord is plugged in. The handle protects the operator from any burn hazard. You can use a metal handle only if the temperature remains less than 55 degrees when running at maximum load under maximum ambient temperature conditions. A plastic handle is molded from the following material: Material GE 2800 BAYER FR2000 2.2.1.2 Color Green Green Designation GN3058 3200

Acoustic and Fan Speed Control Requirements

Sound power levels emitted by the power supply meet the requirements shown in the following table. Sound power is measured as described in ISO7779. Under a condition where inlet air temperature exceeds the limit, sound power level may exceed the limit. The power supply incorporates a variable speed fan. The fan speed varies linearly based on output loading and ambient temperature. The declared sound power levels (LwAd) of the power supply unit (PSU) meet the requirements shown in the following table. Sound power is measured according to ECMA 74 (www.ecma-international.org) and reported according to ISO 9296. The acoustic measurement of the power supply is performed with the power supply fan operating at the RPM corresponding to the operating conditions shown in the following table. The PSU acoustic test report should include at a minimum the following information: power supply dimensions, picture, fan model and size, fan voltage (or duty cycle), and RPM and PSU sound power level at each operating condition. The proper RPM thermally sustainable is determined through PSU thermal testing and should be submitted as an appendix to the acoustic test report. The cage should be tested in a 1+0 non-redundant configuration and a 1+1 redundant configuration.
Table 25. Acoustic Requirements Operating Conditions Inlet Temperature Condition 45C 40C % of Single module Maximum Loading Condition 100% 60% LwAd (BA)

Maximum (1+0 & 1+1) Operating (1+0 & 1+1)

< 6.5 < 5.2

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Idle (1+0 & 1+1)

35C

40%

< 4.0

2.2.1.3

Temperature Requirements

The power supply operates within all specified limits over the Top temperature range described in the following table. The average air temperature difference (Tps) from the inlet to the outlet of the power supply does not exceed 20 degrees C. All airflow passes through the power supply and not over the exterior surfaces of the power supply.
Table 26. Thermal Requirements Item Top Tnon-op Altitude Description Operating temperature range Non-operating temperature range Maximum operating altitude MIN 0 -40 Max 45 70 1524 (5,000) Units C C m (ft)

The power supply meets UL enclosure requirements for temperature rise limits. All sides of the power supply, with exception of the air exhaust side, are classified as Handle, knobs, grips, etc., held for short periods of time only. You must pay special attention to the fan case temperature; it cannot be exceeded under any conditions. 2.2.1.4 LED Marking and Identification

The LED is green or amber when lit.

2.2.2

AC Input Requirements

The 600-W power supply incorporates a universal power input with active power factor correction, which reduces line harmonics in accordance with the EN61000-3-2 and JEIDA MITI standards. 2.2.2.1 AC Inlet Connector

The AC input connector is an IEC 320 C-14 power inlet. This inlet is rated for 10A/250VAC. 2.2.2.2 Efficiency

The following table provides the required minimum efficiency level at four loading conditions: 100%, 50%, 20% and 10%. Efficiency is tested at the AC input voltage 230VAC.

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Power Sub-system Table 27. Efficiency Loading Efficiency Power Factor 100% of Maximum 85% > 0.9 50% of Maximum 89% > 0.9

Intel Server Chassis SC5650 TPS

20% of Maximum 85% > 0.85

10% of Maximum 75% > 0.75

2.2.2.3

AC Input Voltage Specification

The power supply operates within all specified limits over the following input voltage range, as shown in the following table. Harmonic distortion of up to 10% of rated AC input voltage will not cause the power supply to go out of specified limits. The power supply powers off at or below 75 VAC +/-5 VAC range. The power supply starts up at or above 85 VAC +/-4VAC. Application of an input voltage below 85 VAC does not cause damage to the power supply, including a fuse blow.
Table 28. AC Input Rating Parameter MIN Rated MAX Start up VAC 85Vac +/4Vac Power Off VAC 75Vac +/5Vac Max Input Current TBD Arms1,3 TBD Arms2,3 Max Rated Input AC Current TBD Arms4 TBD Arms4

Line Voltage (110) Line Voltage (220) Frequency

90 Vrms 180 Vrms 47 Hz

100-127 Vrms 200-240 Vrms 50/60Hz

140 Vrms 264 Vrms 63 Hz

Notes: 1 2 3 4 Maximum input current at low input voltage range should be measured at 90Vac at max load. Maximum input current at high input voltage range should be measured at 180VAC at max load. This is not to be used for determining agency input current markings. Maximum rated input current is measured at 100 VAC and 200 VAC.

2.2.2.4

AC Line Transient Specification

AC line transient conditions are defined as sag and surge conditions. Sag conditions are also commonly referred to as brownout and defined as AC line voltage drops below nominal voltage conditions. Surge is defined as AC line voltage rises above nominal voltage conditions. The power supply meets requirements under the following AC line sag and surge conditions.

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Intel Server Chassis SC5650 TPS Table 29. AC Line Sag Transient Performance Duration Continuous 0 to 1 AC cycle > 1 AC cycle Sag 10% 100% >10% Operating AC Voltage Nominal AC Voltage ranges Nominal AC Voltage ranges Nominal AC Voltage ranges Line Frequency 50/60 Hz 50/60 Hz 50/60 Hz Loading

Power Sub-system

Performance Criteria No loss of function or performance No loss of function or performance Loss of function acceptable, self recoverable

100% 75% 100%

Table 30. AC Line Surge Transient Performance Duration Continuous 0 to AC cycle Surge 10% 30% Operating AC Voltage Nominal AC Voltages Mid-point of nominal AC Voltages Line Frequency 50/60 Hz 50/60 Hz Performance Criteria No loss of function or performance No loss of function or performance

2.2.2.5

AC Line Fuse

The power supply has a single line fuse on the Line (Hot) wire of the AC input. The line fusing is acceptable for all safety agency requirements. The input fuse is a slow blow type. AC inrush current will not cause the AC line fuse to blow under any conditions. All protection circuits in the power supply will not cause the AC fuse to blow unless a component in the power supply failed. This includes DC output load short conditions. 2.2.2.6 AC In-rush

AC line in-rush current does not exceed 55A peak for up to one-quarter of the AC cycle, after which the input current is no more than the specified maximum input current. The peak in-rush current is less than the ratings of its critical components (including input fuse, bulk rectifiers, and surge limiting device). The power supply meets the in-rush requirements for any rated AC voltage, during turn on at any phase of AC voltage, during a single cycle AC dropout condition, as well as upon recovery after AC dropout of any duration, and over the specified temperature range (Top). 2.2.2.7 Susceptibility Requirements

The power supply meets the following electrical immunity requirements when connected to a cage with an external EMI filter that meets the criteria defined in the SSI document EPS Power Supply Specification. For further information on Intel standards, please request a copy of the Intel Environmental Standards Handbook.
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Intel Server Chassis SC5650 TPS Table 31. Performance Criteria

Level A B C

Description The apparatus should continue to operate as intended. No degradation of performance. The apparatus should continue to operate as intended. No degradation of performance beyond spec limits. Temporary loss of function is allowed provided the function is self-recoverable or restorable by the operation of the controls.

2.2.2.7.1

Electrostatic Discharge Susceptibility

The power supply complies with the limits defined in EN 55024: 1998 using the IEC 61000-42:1995 test standard and performance criteria B defined in Annex B of CISPR 24. 2.2.2.7.2 Fast Transient/Burst

The power supply complies with the limits defined in EN55024: 1998 using the IEC 61000-44:1995 test standard and performance criteria B defined in Annex B of CISPR 24. 2.2.2.7.3 Radiated Immunity

The power supply complies with the limits defined in EN55024: 1998 using the IEC 61000-43:1995 test standard and performance criteria A defined in Annex B of CISPR 24. 2.2.2.7.4 Surge Immunity

The power supply was tested with the system for immunity to AC Ringwave and AC Unidirectional wave, both up to 2kV, per EN 55024:1998, EN 61000-4-5:1995 and ANSI C62.45: 1992. The pass criteria included: No unsafe operation allowed under any condition; all power supply output voltage levels remain within proper spec levels; no change in operating state or loss of data during and after the test profile; no component damage under any condition. The power supply complies with the limits defined in EN55024: 1998 using the IEC 61000-45:1995 test standard and performance criteria B defined in Annex B of CISPR 24. 2.2.2.8 AC Line Dropout / Holdup

The following are the AC dropout requirements.

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Table 32. Holdup Requirements Loading 100% 60% Holdup Time 12 msec 20 msec

An AC line dropout is defined to be when the AC input drops to 0VAC at any phase of the AC line for any length of time. During an AC dropout condition, the power supply meets dynamic voltage regulation requirements. An AC line dropout of any duration will not cause tripping of control signals or protection circuits. If the AC dropout lasts longer than the hold-up time, the power supply recovers and meets all turn-on requirements. The power supply meets the AC dropout requirement over rated AC voltages and frequencies. A dropout of the AC line for any duration will not cause damage to the power supply. 2.2.2.8.1 AC Line 5VSB Holdup

The 5 VSB output voltage stays in regulation under its full load (static or dynamic) during an AC dropout of 70 ms min (=5VSB holdup time) whether the power supply is in an ON or OFF state (PSON asserted or de-asserted). 2.2.2.9 AC Line Fast Transient (EFT) Specification

The power supply meets the EN61000-4-5 directive and any additional requirements in IEC1000-4-5: 1995 and the Level 3 requirements for surge-withstand capability, with the following conditions and exceptions: These input transients do not cause any out-of-regulation conditions, such as overshoot and undershoot, nor do they cause any nuisance trips of any of the power supply protection circuits. The surge-withstand test must not produce damage to the power supply. The supply meets surge-withstand conditions under maximum and minimum DC-output load conditions. 2.2.2.10 AC Line Leakage Current

The maximum leakage current to ground for each power supply should not be more then 3.5mA when tested at 240 VAC. 2.2.2.11 Power Recovery

The power supply recovers automatically after an AC power failure. AC power failure is defined to be any loss of AC power that exceeds the dropout criteria. 2.2.2.11.1 Voltage Brown Out

The power supply complies with the limits defined in EN55024: 1998 using the IEC 61000-411:1995 test standard and performance criteria C defined in Annex B of CISPR 24.
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In addition, the power supply meets the following Intel Requirement: o A continuous input voltage below the nominal input range should not damage the power supply or cause overstress to any power supply component. The power supply must be able to return to normal power up state after a brownout condition. Maximum input current under a continuous brownout should not blow the fuse. The power supply should tolerate a 3-minute ramp from 90 VAC voltage to 0 VAC after the components have reached a steady state condition. Voltage Interruptions

2.2.2.11.2

The power supply complies with the limits defined in EN55024: 1998 using the IEC 61000-411:1995 test standard and performance criteria C defined in Annex B of CISPR 24. 2.2.2.12 AC Line Isolation Requirements

The power supply meets all safety agency requirements for dielectric strength. Transformers isolation between primary and secondary windings complies with the 3000 Vac (4242Vdc) dielectric strength criteria. If the working voltage between primary and secondary dictates a higher di-electric strength test voltage, the highest test voltage is used. In addition, the insulation system complies with reinforced insulation per safety standard IEC 950. Separation between the primary and secondary circuits, and primary to ground circuits, complies with the IEC 950 spacing requirements. 2.2.2.13 Power Factor Correction

The power supply incorporates a power factor correction circuit. The power supply was tested as described in the EN 61000-3-2: Electromagnetic Compatibility (EMC) Part 3: Limits- Section 2: Limits for harmonic current emissions, and meets the harmonic current emissions limits specified for ITE equipment. The power factor must be higher than 0.85 at 20% load and 230VAC. The power supply was tested as described in the JEIDA MITI Guideline for Suppression of High Harmonics in Appliances and General-Use Equipment and meets the harmonic current emissions limits specified for ITE equipment.

2.2.3
2.2.3.1

DC Output Specification
Connector

The power supply provides card edge fingers, which mate to a connector located inside the system. It is a blind-mating type of connector that connects the power supplys output voltages and signals. The card edge finger pin assignments are defined in the following table.

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Intel Server Chassis SC5650 TPS Table 33. Edge Finger Power Supply Connector Pin-out Connector Upper Side +12 V Gold finger edge connector: 2X25 +12 V +12 V +12 V +12 V +12 V +12 V +12 V +12 V +12 V Return +12 V Return +12 V Return +12 V Return +12 V Return +12 V Return +12 V Return +12 V Return +12 V Return +12 V Return 5 VSB 5 VSB +15 VCC PS_KILL PS_ON_CTL SCL Pin No Top. 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 Pin No. Bottom 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50

Power Sub-system

Bottom Side +12 V +12 V +12 V +12 V +12 V +12 V +12 V +12 V +12 V +12 V Return +12 V Return +12 V Return +12 V Return +12 V Return +12 V Return +12 V Return +12 V Return +12 V Return +12 V Return ALERT +12 V Sharing POK -PS_Present A0 -OVER_TEMP

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Signals that are defined as low true or high true use the following convention: Signal# = low true Reserved pins are reserved for future use. 2.2.3.2 Grounding

The ground of the pins of the power supply output connector provides the power return path. The output connector ground pins are connected to safety ground (power supply enclosure). This grounding is well-designed to ensure passing the maximum allowed Common Mode Noise levels. A reliable protective earth ground is provided on the power supply. All secondary circuits are connected to protective earth ground. Resistance of the ground returns to chassis does not exceed 1.0 m. This path may be used to carry DC current. 2.2.3.3 Remote Sense

No remote sense and remote sense return signal is required on this power supply. The power supply operates within specification over the full range of voltages at the power supplys output connector. 2.2.3.4 Output Power / Currents

The following table defines power and current ratings for the 600-W continuous power supply in a 1+0 or 1+1 redundant configuration. The combined output power of both outputs does not exceed the rated output power. The power supply meets both static and dynamic voltage regulation requirements for the minimum loading conditions. Also, the power supply supplies the listed peak currents and power for a minimum of 10 seconds. Outputs are not required to be peak loaded simultaneously.
Table 34. Power Supply Module Load Ratings

Voltage Min +12 V +5 VSB 0.6 A 0.1 A

600-W Max 49 A 3.0 A Peak 54 A 3.5 A

2.2.3.5

Standby Output

The 5VSB output is present when an AC input greater than the power supply turn-on voltage is applied.

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2.2.3.6

Voltage Regulation

The power supply output voltages stay within the following voltage limits when operating at steady state and dynamic loading conditions. These limits include the peak-peak ripple/noise specified in the Voltage Regulation Limits table. All outputs are measured with reference to the GND. The +12V and +5VSB outputs are measured at the power distribution board output harness connector.
Table 35. Voltage Regulation Limits Parameter + 12V + 5VSB Tolerance - 5% / +5% - 5% / +5% MIN +11.40 +4.75 NOM +12.00 +5.00 MAX +12.60 +5.25 Units Vrms Vrms

2.2.3.7

Dynamic Loading

The output voltages remain within limits specified for the step loading and capacitive loading presented in the following table. The load transient repetition rate was tested between 5 Hz and 5 kHz at duty cycles ranging from 10%-90%. The load transient repetition rate is only a test specification. The step load may occur anywhere between the MIN load and MAX load defined in the following table.
Table 36. Transient Load Requirements Output 12 V +5 VSB Max Step Load Size 32.0 A 1 0.5 A Max Load Slew Rate 0.5 A/s 0.5 A/s Test Capacitive Load 2200 F 20 F

Note: 1. Step loads on each 12V output may happen simultaneously. 2. The +12V should be tested with 2200 F evenly split between the three +12V rails.

2.2.3.8

Capacitive Loading

The power supply is stable and meets all requirements with the following capacitive loading ranges. Minimum capacitive loading applies to static load only.
Table 37. Capacitive Loading Conditions Output +12V MIN 2000 MAX 11,000 Units F

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Output +5VSB

MIN 1

MAX 350

Units F

2.2.3.9

Closed Loop Stability

The power supply is unconditionally stable under all line/load/transient load conditions, including capacitive load ranges. A minimum 45-degree phase margin and -10dB-gain margin is met. Closed-loop stability is ensured at the maximum and minimum loads, as applicable. 2.2.3.10 Common Mode Noise

The Common Mode Noise on any output does not exceed 350mV pk-pk over the frequency band of 10 Hz to 20 MHz. 2.2.3.11 Ripple / Noise

The maximum ripple/noise output of the power supply is defined in the following table. This is measured over a bandwidth of 0Hz to 20MHz at the power supply output connectors. A 10F tantalum capacitor in parallel with a 0.1F ceramic capacitor is placed at the point of measurement.
Table 38. Ripple and Noise +12V Output 120mVp-p +5VSB Output 50mVp-p

2.2.3.12

Forced Load Sharing

The +12V output has forced load sharing. The output shares within 10% at full load. All current sharing functions are implemented internal to the power supply by making use of the 12LS signal. The power distribution board connects the 12LS signal between the two power supplies. The failure of a power supply does not affect the load sharing or output voltages of the other supplies still operating. The supplies are able to load share with up to two power supplies in parallel and can operate in a hot-swap / redundant 1+1 configuration. The 5Vsb output is not required to actively share current between power supplies (passive sharing). The 5Vsb outputs of the power supplies are connected together in the system so that a failure or hot swap of a redundant power supply does not cause these outputs to go out of regulation in the system. 2.2.3.13 Timing Requirements

The timing requirements for power supply operation are as follows. The output voltages must rise from 10% to within regulation limits (Tvout_rise) within 5 to 70 ms except for 5VSB, which is

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allowed to rise from 1.0 to 25 ms. All outputs rise monotonically. The following figure shows the timing requirements for the power supply being turned on and off via the AC input, with PSON held low and the PSON signal with the AC input applied.
Table 39. Output Voltage Timing Item Tvout_rise Tvout_on T vout_off Description Output voltage rise time from each main output. All main outputs must be within regulation of each other within this time. All main outputs must leave regulation within this time. Minimum 5.0* Maximum 70* 50 400 Units msec msec msec

* The 5VSB output voltage rise time should be from 1.0 ms to 25.0 ms.

Vout

V1

10% Vout

V2

V3

V4

Tvout

rise

Tvout_off

Tvout_on

Figure 12. Output Voltage Timing

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Table 40. Turn On / Off Timing Item Tsb_on_delay Tac_on_delay Tvout_holdup Tpwok_holdup Tpson_on_delay Tpson_pwok Tpwok_on Tpwok_off Tpwok_low Tsb_vout T5VSB_holdup Note:
1 Tvout_holdup and Tpwok_holdup are defined under 75% loading.

Description Delay from AC being applied to 5 VSB being within regulation. Delay from AC being applied to all output voltages being within regulation. Time all output voltages stay within regulation after loss of AC. Delay from loss of AC to de-assertion of PWOK Delay from PSON# active to output voltages within regulation limits. Delay from PSON# deactive to PWOK being deasserted. Delay from output voltages within regulation limits to PWOK asserted at turn on. Delay from PWOK de-asserted to 12-V output voltage dropping out of regulation limits. Duration of PWOK being in the de-asserted state during an off/on cycle using AC or the PSON signal. Delay from 5 VSB being in regulation to O/Ps being in regulation at AC turn on. Time the 5 VSB output voltage stays within regulation after loss of AC.

Minimum

Maximum 1500 2500

Units ms ms ms ms

21 20 5 400 50 100 1 100 50 70 1000 1000

ms ms ms ms ms ms ms

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Figure 13. Turn On/Off Timing (Power Supply Signals)


A C Input

T vout_h oldup

V out

T A C _on _delay T sb_ on _delay PW O K T pw ok_on T pw ok_h oldup T pw ok_off

T pw ok_low T sb_ on _delay T pw ok_on Tp T pson

5V SB

T sb_ vout

T 5V S B _ ho ldup
T pson _on _delay

PSO N

A C turn on/off cycle

PSO N turn on/off cycle

2.2.3.14

Hot Swap Requirement

Hot swapping a power supply is the process of inserting and extracting a power supply from an operating power system. During this process, the output voltages remain within the capacitive load limits. Up to two power supplies can be on a single AC line. The power supply hot swaps by the following method. Extraction: The AC power disconnects from the power supply as the power supply is extracted from the system. This can occur in standby mode or power-on mode. Insertion: The AC power connects to the power supply as the power supply is inserted into the system. The power supply powers on into either standby mode or power-on mode. In general, a failed (off by internal latch or external control) power supply may be removed then replaced with a good power supply; however, hot swap will work with both operational as well as failed power supplies. The newly inserted power supply will go into either standby or power-on mode once inserted. 2.2.3.15 Residual Voltage Immunity in Standby Mode

The power supply is immune to any residual voltage placed on its 12-V output (typically a leakage voltage through the system from standby output) up to 1000 mV. This residual voltage does not have any adverse effects on the power supply, including additional power dissipation or over-stressing / over-heating any internal components or adversely affecting the turn-on performance (no protection circuits tripping during turn on).

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While in standby mode, at no load condition, the residual voltage on the 12-V output does not exceed 100 mV. 2.2.3.16 Soft Starting

The power supply contains control circuits that provide monotonic soft start of its outputs without overstressing the AC line or any power supply components at any specified AC line or load conditions. There is no requirement for rise time on the 5VSB but the turn on/off is monotonic. 2.2.3.17 Zero Load Stability Requirements

When the power subsystem operates in a no-load condition in a 1+0 or 1+1 configuration, it does not need to meet the output regulation specification, but it must operate without any tripping of over-voltage or other fault circuitry. When the power subsystem is subsequently loaded, it must begin to regulate and source current without fault.

2.2.4

Protection Circuits

Protection circuits inside the power supply cause only the power supplys main outputs to shut down. If the power supply latches off due to a protection circuit tripping, an AC cycle OFF for 15 seconds and a PSON# cycle HIGH for 1 second will reset the power supply. 2.2.4.1 Over-current Protection (OCP)

The power supply has a current limit to prevent the +5 VSB and +12 V outputs from exceeding the values shown in the following table. If the current limits are exceeded, the power supply shuts down and latches off. The latch is cleared by toggling the PSON# signal or by an AC power interruption. The power supply is not damaged from repeated power cycling in this condition. 5 VSB is protected under over-current or shorted conditions so no damage can occur to the power supply.
Table 41. Over-current Protection (OCP) Output Voltage +12V +5VSB Over-current Protection Limits 120% min (= 58.8 A min); 140% max (= 68.6 A max) 120% min (= 3.6 A min); 200% max (= 6.0 A max)

2.2.4.2

Over-voltage Protection (OVP)

The power supplys over-voltage protection is locally sensed. The power supply will shut down and latch off after an over-voltage condition occurs. You can clear this latch by toggling the PSON# signal or by an AC power interruption. The following table contains the over-voltage limits. The values are measured at the output of the power supplys connectors. The voltage

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never exceeds the maximum levels when measured at the power pins of the power supply connector during any single point of fail. The voltage will never trip any lower than the minimum levels when measured at the power pins of the power supply connector.
Table 42. Over-voltage Protection Limits Output Voltage +12 V +5 VSB MIN (V) 13.3 5.7 MAX (V) 14.5 6.5

2.2.4.3

Over-temperature Protection (OTP)

The power supply is protected against over-temperature conditions caused by loss of fan cooling, excessive ambient temperature, or excessive loading. Sensing points are placed at hot spots. In an OTP condition, the power supply shuts down. When the power supply temperature drops to within specified limits, the power supply restores power automatically, while the 5VSB always remains on. The OTP circuit has built-in hysteresis such that the power supply does not oscillate on and off due to temperature recovery conditions. The OTP trip level has a minimum of 4 Celcius of ambient temperature hysteresis.

2.2.5

Control and Indicator Functions

The following sections define the input and output signals from the power supply. Signals that can be defined as low true use the following convention: signal# = low true 2.2.5.1
#

PSON# Input Signal

The PSON signal is required to remotely turn on/off the power supply. PSON# is an active low signal that turns on the +12V power rail. When this signal is not pulled low by the system or left open, the outputs (except for the +5VSB) turn off. This signal is pulled to a standby voltage by a pull-up resistor internal to the power supply.

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Table 43. PSON# Signal Characteristic

Signal Type

Accepts an open collector/drain input from the system. Pull-up to VSB located in power supply. ON OFF MIN MAX 0V 2.0V 1.0V 5.25V 4mA 5msec 400msec 50msec

PSON# = Low PSON# = High or Open

Logic level low (power supply ON) Logic level high (power supply OFF) Source current, Vpson = low Power up delay: PWOK delay: Tpson_on_delay T pson_pwok

2.2.5.2

PSKill

The purpose of the PSKill pin is to allow for hot swapping of the power supply. The PSKill pin on the power supply is shorter than the other signal pins. When a power supply is operating in parallel with other power supplies and then extracted from the system, the PSKill pin will quickly turn off the power supply and prevent arcing of the DC output contacts. TPSKill (shown in the following table) is the minimum time delay from the PSKill pin un-mating to when the power pins un-mate. The power supply must discharge its output inductor within this time from the unmating of the PSKill pin. When the PSKill signal pin is not pulled down or left open (power supply is extracted from the system), the power supply shuts down regardless of the condition of the PSON# signal. The mating pin of this signal in the system should be tied to ground. Internal to the power supply, the PSKill pin should be connected to a standby voltage through a pull-up resistor. Upon receiving a LOW state signal at the PSKill pin, the power supply is allowed to turn on via the PSON# signal. A logic LOW on this pin by itself should not turn on the power outputs.
Table 44. PSKILL Signal Characteristics Signal Type (Input Signal to Supply) Accepts a ground input from the system. Pull-up to VSB located in the power supply. ON OFF OFF

PSKILL = Low, PSON# = Low PSKILL = Open, PSON# = Low or Open PSKILL = Low, PSON# = Open

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MIN Logic level low (power supply ON) Logic level high (power supply OFF) Source current, Vpskill = low Delay from PSKILL=High to power supply turned off (TPSKill)1
Note:

MAX 1.0 V 5.25 V 4 mA 100 s

0V 2.0 V

1. TPSKill is the time from the PSKill signal de-asserting HIGH to the power supplys output inductor discharging.

2.2.5.3

PWOK (Power OK) Output Signal

PWOK is a power OK signal and is pulled HIGH by the power supply to indicate that all the outputs are within the regulation limits of the power supply. When any output voltage falls below regulation limits or when AC power has been removed for a time sufficiently long so the power supply operation is no longer guaranteed, PWOK will be de-asserted to a LOW state. The start of the PWOK delay time is inhibited as long as any power supply output is in current limit.
Table 45. PWOK Signal Characteristics Signal Type Open collector/drain output from power supply. Pull-up to VSB located in system. Power OK Power Not OK MIN Logic level low voltage, Isink=4mA Logic level high voltage, Isource=200A Sink current, PWOK = low Source current, PWOK = high PWOK delay: Tpwok_on PWOK rise and fall time Power down delay: T pwok_off 1 ms 100 ms 0V 2.4 V MAX 0.4 V 5.25 V 4 mA 2 mA 1000 ms 100 s 200 ms

PWOK = High PWOK = Low

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2.2.5.4

LEDs

There is a bi-color LED and a single color LED to indicate power supply status. The LED operation is defined in the following table.

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Table 46. LED Indicators Power Supply Condition Status LED (AC OK / Power Supply Fail) AC Power Off AC Power On in Standby Mode AC On and All Outputs in Normal Mode Any DC Outputs Short Circuit OFF Green Green Green OFF DC Fan Not Spinning OTP Amber Amber Power Led (Power Good) OFF OFF Green Power Distribution Board protection only; module OK Module protection only Send out alert signal Remarks

OFF Green

The LEDs are visible on the power supplys exterior face. The LEDs location meets Electrostatic Discharge (ESD) requirements. LEDs are securely mounted in such a way that incidental pressure on the LEDs does not cause them to be displaced. Bits allow the LED states to be forced via the SMBus. The following capabilities are required: Force Amber ON for failure conditions. No Force (LED state follows power supply present state)

The power-on default is No Force. The default is restored whenever PSON transitions to assert.

2.2.6

PMBus Monitoring Interface

The PMBus features included in this specification are requirements for ac/dc silver box power supply for use in mainstream server systems. This specification is based on the PMBus specifications parts I and II, revision 1.2. 2.2.6.1 Related Documents

PMBus Power System Management Protocol Specification Part I General Requirements, Transport And Electrical Interface; Revision 1.2 PMBus Power System Management Protocol Specification Part II Command Language; Revision 1.2 System Management Bus (SMBus) Specification Version 2.0
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2.2.6.2

Addressing

The power supply PMBus device address locations are shown in the following table. For redundant systems there are up to three signals to set the address location of the power supply once it is installed in the system: Address2, Address1, and Address0. For non-redundant systems the power supply device address location should be B0h. 0/0/1 0/1/0 0/1/1 1/0/0 1/0/1 1/1/0 System addressing 0/0/0 Address2/Address1 / Address0 PMBus device read B0h/B1h B2h/B3 B4h/B5 B6h/B7 B8h/B9 BAh/BB BCh/BD 1 addresses 2 h h h h h h 1 Non-redundant power supplies use the 0/0/0 address location 2 The addressing method uses the 7 MSB bits to set the address and the LSB to define whether a device is reading or writing. The addresses defined above use 8 bits including the read/write bit. IPMI FRU Addressing: If the power supply has a FRU (field replaceable unit) serial EEPROM; it should be located at the following addresses. 0/0/1 0/1/0 0/1/1 1/0/0 1/0/1 1/1/0 System addressing 0/0/0 Address2/Address1 / Address0 FRU device A0h/A1h A2h/A3 A4hA5 A6h/A7 A8h/A9 AAh/AB ACh/AD 1 addresses 2 h h h h h h 1 Non-redundant power supplies use the 0/0/0 address location. 2 The addressing method uses the 7 MSB bits to set the address and the LSB to define whether a device is reading or writing. The addresses defined above use 8 bits including the read/write bit. 1/1/1 AEh/AF h 1/1/1 BEh/BF h

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2.3

600-W Power Distribution Board (PDB)

This specification defines the 570-W cage for the ERP12V 600-W 1+1 redundant power supply and for the ERP 12V 600-W 2+0 non-redundant power supply. The cage is designed to plug directly to the output connector of the power supply and contains three DC/DC power converters to produce other required voltages: +3.3VDC, +5VDC, and 12VDC along with additional 12V rail 240VA protection and a FRU EEPROM.

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2.3.1

Mechanical Overview

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Figure 14. Mechanical Drawing for Dual (1+1 Configuration) Power Supply Enclosure

2.3.1.1

Airflow Requirements

There is no fan in the cage; the cage is cooled by the fan in the power supply module(s) when combined together in the system.

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2.3.1.2

Temperature Requirements

The PDB operates within all specified limits over the Top temperature range. Table 47. Environmental Requirements
Item Top Tnon-op Altitude Description Operating temperature range. Non-operating temperature range. Maximum operating altitude MIN 0 -40 MAX 45 70 150 0 Units C C m

2.3.1.3

Efficiency

Each DC/DC converter shall have a minimum efficiency of 85% at Max load and over +12V line voltage range and over temperature and humidity range. 2.3.1.4 Output Connectors

Listed or recognized component appliance wiring material (AVLV2), CN, rated min 105 degrees C, 300VDC is used for all output wiring.
Table 48. Cable Lengths Length (mm) 800 350 500 350 250 100 750 To Connector # P1 P2 P3 P4 P5 P6 P7 Number of Pins 24 8 8 5 4 4 4

From Power Supply cover exit hole Power Supply cover exit hole Power Supply cover exit hole Power Supply cover exit hole Power Supply cover exit hole Extension Power Supply cover exit hole

Description

Baseboard Power Connector Processor 0 Power Connector Processor 1 Power Connector Power PSMI Connector Peripheral Power Connector Peripheral Power Connector Peripheral Power Connector

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From Extension Power Supply cover exit hole Extension 75

Length (mm)

To Connector # P8 P9 P10

Number of Pins 4 5 5

Description Peripheral Power Connector Right-angle SATA Power Connector SATA Power connector for fixed HDD Connector

750 75

2.3.1.5

Baseboard Power Connector (P1)

Connector housing: 24-Pin Molex* Mini-Fit Jr. 39-01-2245 or equivalent Contact: Molex* Mini-Fit, HCS, Female, Crimp 44476 or equivalent
Table 49. P1 Baseboard Power Connector Pin 1* Signal +3.3VDC 3.3V RS 2 3* +3.3VDC COM COM RS 4* +5VDC 5V RS 5 6 7 8 9 10 11 COM +5VDC COM PWR OK 5 VSB +12V3 +12V3 +12V3 RS 12 +3.3VDC 18 AWG Color Orange Orange (24AWG) Orange Black Black (24AWG) Red Red (24AWG) Black Red Black Gray (24AWG) Purple Yellow Yellow Yellow (24AWG) Orange Pin 13 14 15 16 17 18 19 20 21 22 23 24 Signal +3.3VDC -12VDC COM PSON# COM COM COM Reserved +5VDC +5VDC +5VDC COM 18 AWG Color Orange Blue Black Green (24AWG) Black Black Black N.C. Red Red Red Black

Note: Remote Sense wire double-crimped.

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2.3.1.6

Processor 0 Power Connector (P2)

Connector housing: 8-Pin Molex* 39-01-2080 or equivalent Contact: Molex* 44476-1111 or equivalent
Table 50. P2 Processor 0 Power Connector Pin 1 2 3 4 Signal COM COM COM COM 18 AWG Color Black Black Black Black Pin 5 6 7 8 Signal +12V1 +12V1 +12V2 +12V2 18 AWG Color White White Brown Brown

Processor 1 Power Connector (P3) Connector housing: 8-Pin Molex* 39-01-2080 or equivalent Contact: Molex* 44476-1111 or equivalent
Table 51. P3 Processor 1 Power Connector Pin 1 2 3 4 Signal COM COM COM COM 18 AWG Color Black Black Black Black Pin 5 6 7 8 Signal +12V1 +12V1 +12V2 +12V2 18 AWG Color White Brown White White

2.3.1.7

Power Signal Connector (P4)

Connector housing: 5-Pin Molex* 50-57-9405 or equivalent Contacts: Molex* 16-02-0087 or equivalent
Table 52. P4 Power Signal Connector Pin 1 2 3 4 Signal I2C Clock I2C Data Reserved COM White Yellow N.C. Black 24 AWG Color

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Pin 5 3.3 RS

Signal Orange

24 AWG Color

2.3.1.8

Peripheral Power Connectors (P5, P6, P7, P8)

Connector housing: Amp* 1-480424-0 or equivalent Contact: Amp* 61314-1 contact or equivalent
Table 52. P5, P6, P7, and P8 Peripheral Power Connectors Pin 1 2 3 4 Signal +12V4 COM COM +5 VDC 18 AWG Color Green Black Black Red

2.3.1.9

Right-angle SATA Power Connectors (P9)

Connector housing: JWT* F6002HS0-5P-18 or equivalent


Table 53. P9 Right-angle SATA Power Connector Pin 1 2 3 4 5 +3.3V COM +5VDC COM +12V4 Signal 18 AWG Color Orange Black Red Black Green

2.3.1.10

SATA Power Connector (P10)

Connector housing: JWT* A3811H00-5P or equivalent Contact: JWT* A3811TOP-0D or equivalent

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Table 54. P10 SATA Power Connector Pin 1 2 3 4 5 +3.3V COM +5VDC COM +12V4 Signal 18 AWG Color Orange Black Red Black Green

2.3.2

DC Output Specification

2.3.2.1

Remote Sense

The cage 12V to 3.3V and 5V converters use remote sensing to regulate out voltage drops in the system for the +3.3V output. The remote sense output impedance to this DC/DC converter must be greater than 200. This is the value of the resistor connecting the remote sense to the output voltage internal to the DC/DC converter. Remote sense must be able to regulate out of up to 300mV drop on the +3.3V and 5V outputs. Also, the power supply ground return remote sense (ReturnS) passes through the PDB and the output harness to regulate out ground drops for its +12V and 5Vsb output voltages. The power supply uses remote sense (12VRS) to regulate out drops up to the 240VA protection circuits on the PDB. 2.3.2.2 +12V Outputs Load Requirements

This section describes the +12V output power requirements from the cage with one or two 600W power supplies plugged into the input of the cage. The power distribution board divides up the 12-V power from power supply modules into five separate 240VA limited channels. Channels 1 through 4 supply 12-V power directly to the end system. A channel supplies power to the 3.3V, 5V, and -12V PDB converters. .
Table 55. +12V Outputs Load Ratings +12V1/2/3/4 combined output limit = 64A / 72A pk max +12V1 MAX Load MIN Static / Dynamic Load Peak load (12 seconds)
1.

+12V2 16A 0.2A 18A

+12V3 16A 0.1A 18A

+12V4 16A 0.1A 18A

16A 0.2A 18A

Peak power and current loading shall be supported for a minimum of 12 seconds.

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2.3.2.3

DC/DC Converters Loading

The following table defines the power and current ratings for the three DC/DC converters located on the cage; each is powered from a +12V5 rail. The three converters meet both static and dynamic voltage regulation requirements for the minimum and maximum loading conditions. Note: 3.3V/5V combined power limit: 170 W max
Table 56. DC/DC Converters Load Ratings +12VDC Input DC/DC Converters +3.3V Converter MAX Load MIN Static / Dynamic Load
1. 2. 3.

+5V Converter 30.0A 0A

-12V Converter 0.3A 0A

24.0A 0A

Maximum continuous total DC output power should not exceed 570 W. Peak power and current loading shall be supported for a minimum of 12 seconds. Combined 3.3V and 5V power shall not exceed 170 W.

2.3.2.4

DC/DC Converters Voltage Regulation

The DC/DC converters output voltages stay within the following voltage limits when operating at steady state and dynamic loading conditions. These limits include the peak-peak ripple/noise. All outputs are measured with reference to the return remote sense signal (ReturnS). The 3.3V and 5V outputs are measured at the remote sense point; all other voltages are measured at the output harness connectors.
Table 57. Voltage Regulation Limits Converter Output + 3.3VDC + 5VDC + 12VDC (12V1/2/3/4) - 12VDC + 5VSB Tolerance - 5% / +5% - 5% / +5% - 5% / +5% - 10% / +10% MIN +3.14 +4.75 +11.40 -10.80 NOM +3.30 +5.00 +12.00 -12.00 MAX +3.46 +5.25 +12.60 -13.20 UNITS VDC VDC VDC VDC

See Power Supply Specification; measured at the power distribution board harness connectors.

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2.3.2.5

DC / DC Converters Dynamic Loading

The output voltages remain within limits specified for step loading and capacitive loading as specified in the following table. The load transient repetition rate is tested between 50 Hz and 5 kHz at duty cycles ranging from 10%-90%. The load transient repetition rate is only a test specification. The step load may occur anywhere between MIN load and MAX load conditions.
Table 58. Transient Load Requirements Output + 3.3VDC + 5VDC +12VDC (12V1/2/3/4/5) - 12VDC +5VSB Max Step Load Size 5.0A 6.0A Max Load Slew Rate 0.25 A/s 0.25 A/s Test Capacitive Load 250 F 400 F

See the Power Supply specification for details. Not rated Not rated F

See the the Power Supply specification for details.

2.3.2.6

DC / DC Converter Capacitive Loading

All outputs of the DC / DC converter are stable and meet all requirements with the following capacitive loading ranges.
Table 59. Capacitive Loading Conditions Converter Output +3.3VDC +5VDC -12VDC MIN 250 400 1 MAX 6,800 4,700 350 Units F F F

Note: Refer to the Power Supply specification for the equivalent data on +12V and +5VSB output.

2.3.2.7

DC/DC Converters Closed Loop Stability

Each DC/DC converter is unconditionally stable under all line/load/transient load conditions, including capacitive load ranges. A minimum of 45 degrees phase margin and 10dB-gain margin is required. 2.3.2.8 Common Mode Noise

The Common Mode Noise on any output does not exceed 350 mV peak-peak over the frequency band of 10 Hz to 30 MHz.

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2.3.2.9

DC/DC Converters Ripple/Noise

The maximum allowed ripple/noise output of each DC/DC Converter is defined in the following table. This is measured over a bandwidth of 0Hz to 20MHz at the PDB output connectors. A 10F tantalum capacitor in parallel with a 0.1F ceramic capacitor is placed at the point of measurement.
Table 60. Ripple and Noise +3.3V Output 50mVp-p +5V Output 50mVp-p -12V Output 120mVp-p

Note: Refer to the Power Supply specification for the equivalent data on +12V and +5VSB output.

2.3.2.10

Fan Operation in Standby Mode

The fans on the power distribution board continue to operate at their lowest speed (5V) when in standby mode. 2.3.2.11 Timing Requirements

The timing requirements for the power supply/PDB combination are as follows. The output voltages must rise from 10% to within regulation limits (Tvout_rise) within 5 to 70 ms, except for 5VSB, which is allowed to rise from 1.0 to 25 ms. The +3.3V, +5V, and +12V output voltages start to rise at approximately the same time. All outputs rise monotonically. The +5V output is greater than the +3.3V output during any point of the voltage rise. The +5V output is never greater than the +3.3V output by more than 2.25V. Each output voltage reaches regulation within 50ms (Tvout_on) of each other during turn on of the power supply. Each output voltage falls out of regulation within 400 msec (Tvout_off) of each other during turn off. The following figure shows the timing requirements for the power supply being turned on and off via the AC input, with PSON held low and the PSON signal, with the AC input applied.
Table 61. Output Voltage Timing Item Tvout_rise Tvout_on T vout_off Description Output voltage rise time from each main output. All main outputs must be within regulation of each other within this time. All main outputs must leave regulation within this time. Minimum 5.0* Maximum 70* 50 400 Units msec msec msec

* The 5VSB output voltage rise time shall be from 1.0 ms to 25.0 ms.

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Vout

V1

10% Vout

V2

V3

V4

Tvout

rise

Tvout_off

Tvout_on

Figure 15. Output Voltage Timing Table 62. Turn On / Off Timing Item Tsb_on_delay Tac_on_delay Tvout_holdup Tpwok_holdup Tpson_on_delay Tpson_pwok Tpwok_on Description Delay from AC being applied to 5VSB being within regulation. Delay from AC being applied to all output voltages being within regulation. Time all output voltages stay within regulation after loss of AC. 75% 21 20 5 400 50 100 500 Loading Minimum Maximum 1500 2500 Units ms ms ms ms ms ms ms

Delay from loss of AC to de-assertion of PWOK 75% Delay from PSON# active to output voltages within regulation limits. Delay from PSON# deactive to PWOK being de-asserted. Delay from output voltages within regulation limits to PWOK asserted at turn on.

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Item Tpwok_off

Description Delay from PWOK de-asserted to output voltags (3.3V, 5V, 12V, -12V) dropping out of regulation limits. Duration of PWOK being in the de-asserted state during an off/on cycle using AC or the PSON signal. Delay from 5VSB being in regulation to O/Ps being in regulation at AC turn on. Time the 5VSB output voltage stays within regulation after loss of AC.

Loading

Minimum 1

Maximum

Units ms

Tpwok_low

ms 100 ms ms

Tsb_vout T5VSB_holdup

50 70

1000

AC Input

Tvout_holdup

Vout

TAC_on_delay Tsb_on_delay PWOK Tpwok_on Tpwok_holdup Tpwok_off

Tpwok_low Tsb_on_delay Tpwok_on Tpwok_off Tpson_pwok

5VSB

Tsb_vout

T5VSB_holdup
Tpson_on_delay

PSON

AC turn on/off cycle

PSON turn on/off cycle

Figure 16. Turn On/Off Timing (Power Supply Signals)

2.3.2.12

Residual Voltage Immunity in Standby Mode

Each DC/DC converter is immune to any residual voltage placed on its respective output (typically a leakage voltage through the system from standby output) up to 500mV. There is no additional heat generated, nor is there any stress of any internal components with this voltage

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applied to any individual output, or all outputs simultaneously. Residual voltage also does not trip the power supply protection circuits during turn on. Residual voltage at the power supply outputs for no-load condition does not exceed 100mV when AC voltage is applied and the PSON# signal is de-asserted. 2.3.2.13 Soft Start Requirements

The power supply contains a control circuit which provides monotonic soft start for its outputs without overstressing the AC line or any power supply components at any specified AC line or load conditions. There is no requirement for rise time on the 5VSB, but the turn on/off is monotonic.

2.3.3

Protection Circuits

Protection circuits inside the cage (and the power supply) cause the power supplys main +12V output to shut down, thereby forcing the remaining three outputs on the cage to shut down. If the power supply latches off due to a protection circuit tripping, an AC cycle OFF for 15 sec min and a PSON# cycle HIGH for 1 second will reset the power supply and the PDB. 2.3.3.1 Over-current Protection (OCP) / 240VA Protection

Each DC/DC converter output on the cage has individual OCP circuits. The PS+cage combination will shut down and latch off after an over-current condition occurs. This latch is cleared by toggling the PSON# signal or by an AC power interruption. The values are measured at the PDB harness connectors. The DC/DC converters are not damaged from repeated power cycling in this condition. The +12V output from the power supply is divided on the PDB into 5 channels and each channel is limited to 240VA of power except for +12V5 (+12V5 is not user accessible). Current sensors and limit circuits are available to shut down the entire PS+PDB combination if the limit is exceeded. The over-current limits are listed in the following table.
Table 63. Over-current Protection Limits / 240VA Protection Output Voltage +3.3V +5V -12V +12V1 +12V2 Output Voltage +12V3 MIN OCP Trip Limits 110% min (= 26.4A min) 110% min (= 33A min) 0.625A 18A 18A MIN OCP Trip Limits 18A MAX OCP Trip Limits 150% max (= 36A max) 150% max (= 45A max) 2.0A 20Amax 20Amax MAX OCP Trip Limits 20A max

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+12V4 +5VSB

18A

20A max

See the Power Supply specification for details.

2.3.3.2

Over-voltage Protection (OVP)

Each DC/DC converter output on the cage has individual OVP circuits built in and is locally sensed. The PS+cage combination will shut down and latch off after an over-voltage condition occurs. This latch can be cleared by toggling the PSON# signal or by an AC power interruption. The following table defines the over-voltage limits. The values are measured at the cage harness connectors. The voltage does not exceed the maximum levels when measured at the power pins of the output harness connector during any single point of fail. The voltage does not trip any lower than the minimum levels when measured at the power pins of the cage connector.
Table 64. Over-voltage Protection (OVP) Limits Output Voltage +3.3V +5V -12V +12V1/2/3/4 +5vsb OVP MIN (V) 3.9 5.7 -13.3 See Power Supply specification. See Power Supply specification. OVP MAX (V) 4.5 6.5 -14.5

2.3.3.3

Over Temperature Protection (OTP)

There is not a requirement of thermal sensor located on the cage and have OTP function itself. If there is no OTP function build in the cage, the cage should be protected by the OTP function in the module when over heated with no unrecoverable damage.

2.3.4

Control and Indicator Functions (Hard-wired)

The following sections define the input and output signals from the power distribution board. Signals that can be defined as low true use the following convention: signal# = low true

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2.3.4.1

PSON# Input and Output Signals

The PSON# signal is required to remotely turn on/off the power supply. PSON# is an active low signal that turns on the +3.3V, +5V, +12V, and -12V power rails. When this signal is not pulled low by the system, or left open, the outputs (except for the +5VSB) turn off. This signal is pulled to a standby voltage by a pull-up resistor internal to the power supply.
Table 65. PSON# Signal Characteristics Signal Type Accepts an open collector/drain input from the system. Pull-up to VSB located in power supply. ON OFF MIN Logic level low (power supply ON) Logic level high (power supply OFF) Source current, Vpson = low Power up delay: PWOK delay: Tpson_on_delay T pson_pwok 5msec 0V 2.0V MAX 1.0V 5.25V 4mA 400msec 50msec

PSON# = Low PSON# = High or Open

2.3.4.2

PSKILL

The purpose of the PSKill pin is to allow for hot swapping of the power supply. The mating pin of this signal on the cage input connector is tied to ground, and its resistance is less than 5 ohms. 2.3.4.3 PWOK (Power OK) Input and Output Signals

PWOK is a power OK signal and will be pulled HIGH by the power supply to indicate that all the outputs are within the regulation limits of the power supply. When any output voltage falls below regulation limits, or when AC power has been removed for a time sufficiently long so that power supply operation is no longer guaranteed, PWOK will be de-asserted to a LOW state. The start of the PWOK delay time is inhibited as long as any power supply output is within current limit.

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Table 66. PWOK Signal Characteristics Signal Type Open collector/drain output from power supply. Pull-up to VSB located in system. Power OK Power Not OK MIN Logic level low voltage, Isink=4mA Logic level high voltage, Isource=200A Sink current, PWOK = low Source current, PWOK = high PWOK delay: Tpwok_on PWOK rise and fall time Power down delay: T pwok_off 1ms 100ms 0V 2.4V MAX 0.4V 5.25V 4mA 2mA 1000ms 100sec 200msec

PWOK = High PWOK = Low

2.3.4.4

SMBAlert#

The SMBAlert# signal indicates that the power supply is experiencing a problem that the user should investigate. The signal may be asserted due to critical events or warning events. The SMBAlert# signal will be asserted whenever there is at least one event condition in the power supply or cage. The SMBAlert# signal will automatically be cleared when the cause of the event is no longer present.

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Table 67. SMBAlert# Signal Characteristics Signal Type (Active Low) Alert# = High Alert# = Low Open collector / drain output from power supply. Pull-up to VSB located in system. OK Power Alert to system MIN Logic level low voltage, Isink=4 mA Logic level high voltage, Isink=50 A Sink current, Alert# = low Sink current, Alert# = high Alert# rise and fall time 0V MAX 0.4 V 5.25 V 4 mA 50 A 100 s

2.3.5

PMBus

The PMBus features included in this specification are requirements for ac/dc silver box power supply for use in mainstream server systems. This specification is based on the PMBus specifications parts I and II, revision 1.2. 2.3.5.1 Related Documents

PMBus Power System Management Protocol Specification Part I General Requirements, Transport And Electrical Interface; Revision 1.2 PMBus Power System Management Protocol Specification Part II Command Language; Revision 1.2 System Management Bus (SMBus) Specification Version 2.0 2.3.5.2 Addressing

The power supply PMBus device address locations are shown below. For redundant systems there are up to three signals to set the address location of the power supply once it is installed in the system; Address2, Address1, Address0. For non-redundant systems the power supply device address location should be B0h. 0/0/1 0/1/0 0/1/1 1/0/0 1/0/1 1/1/0 System addressing 0/0/0 Address2/Address1 / Address0 PMBus device read B0h/B1h B2h/B3 B4h/B5 B6h/B7 B8h/B9 BAh/BB BCh/BD 1 addresses 2 h h h h h h 1 Non-redundant power supplies will use the 0/0/0 address location 2 The addressing method uses the 7 MSB bits to set the address and the LSB to define whether a device is reading or writing. The addresses defined above use 8 bits including the read/write bit.
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IPMI FRU Addressing If the power supply has a FRU (field replaceable unit) serial EEPROM; it shall be located at the following addresses. 0/0/1 0/1/0 0/1/1 1/0/0 1/0/1 1/1/0 System addressing 0/0/0 Address2/Address1 / Address0 FRU device A0h/A1h A2h/A3 A4hA5 A6h/A7 A8h/A9 AAh/AB ACh/AD 2 1 addresses h h h h h h 1 Non-redundant power supplies will use the 0/0/0 address location. 2 The addressing method uses the 7 MSB bits to set the address and the LSB to define whether a device is reading or writing. The addresses defined above use 8 bits including the read/write bit. 1/1/1 AEh/AF h

2.4

1000-W Power Supply

The 1000-W specification defines a non-redundant power supply that supports entry server systems. This 1000-W power supply has 8 outputs: 3.3V, 5V, 12V1, 12V2, 12V3, 12V4, -12V and 5VSB. The power supply contains a single 80-mm fan for cooling the power supply and part of the system.

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2.4.1

Mechanical Overview

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Figure 17. Mechanical Drawing of the 1000-W Power Supply Enclosure

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2.4.2

Airflow Requirements

The power supply incorporates one 80-mm fan for self-cooling and system cooling. The fan provides no less than 14 CFM airflow through the power supply when installed in the system. The cooling air enters the power module from the non-AC side.

2.4.3

Acoustic Requirements

The declared sound power level of the power supply assembly does not exceed the levels specified in the following table.
Table 68. Sound Power Requirement Operating Conditions Maximum Operating Idle Inlet Temperature Condition 45C 40C 35C % of Maximum Loading Condition 100% 60% 40% LwAd (BA) 6.5 4.7 4.0

The declared sound power level is measured according to ECMA 74 and reported according to ECMA 109. The fan RPM settings for the two operating conditions are determined through thermal analysis and/or testing prior to the sound power level measurement. To measure the power supply assembly sound power levels corresponding to the two operating conditions, the fan in the power supply assembly is powered externally to the two RPM settings. The 45 Celcius inlet temperature is derived based on standard system ambient temperature assumptions (25 Celcius and 35 Celcius), typical temperature rise within the system, and thermal impact of fan speed control. Pure Tones: The power supply assembly does not produce any prominent discrete tones, as determined according to ECMA 74, Annex D.

2.4.4

Temperature Requirements

The power supply operates within all specified limits over the Top temperature range. All airflow passes through the power supply and not over the exterior surfaces of the power supply.
Table 69. Thermal Requirements Item Top Tnon-op Item Description Operating temperature range. Non-operating temperature range. Description MIN 0 -40 MIN MAX 45 70 MAX Units C C Units

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Altitude

Maximum operating altitude

1500

The power supply meets UL enclosure requirements for temperature rise limits. All sides of the power supply, with exception of the air exhaust side, are classified as Handle, knobs, grips, etc., held for short periods of time only. 2.4.4.1 AC Input Connector

The AC input connector is an IEC 320 C-14 power inlet. This inlet is rated for 15A/250VAC. 2.4.4.2 LED Marking and Identification

The LED is green or amber when lit. The LED is labeled with the two symbols as illustrated: Power Symbol Fail Symbol

!
Figure 18. LED Markings

2.4.5
2.4.5.1

AC Input Voltage Requirements


AC Input Voltage Specification

The power supply operates within all specified limits over the input voltage range shown in the following table. Harmonic distortion of up to 10% of the rated line voltage must not cause the power supply to go out of specified limits. The power supply does power off if the AC input is less than 75VAC +/-5VAC range. The power supply starts up if the AC input is greater than 85VAC +/-4VAC. Application of an input voltage below 85VAC does not cause damage to the power supply, including a fuse blow.
Table 70. AC Input Rating Parameter Voltage (110) Voltage (220) MIN 90 Vrms 180 Vrms Rated 100-127 Vrms 200-240 Vrms VMAX 140 Vrms 264 Vrms IMAX 15 A1,3 7 A2,3 Start up VAC 85VAC +/4VAC Power Off VAC 75VAC +/5VAC

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Parameter Frequency
1. 2. 3.

MIN 47 Hz

Rated 50/60

VMAX 63 Hz

IMAX

Start up VAC

Power Off VAC

Maximum input current at low input voltage range is measured at 90VAC, at max load. Maximum input current at high input voltage range is measured at 180VAC, at max load. This requirement is not used for determining agency input current markings.

2.4.5.2

AC Line Transient Specification

AC line transient conditions are defined as sag and surge conditions. Sag conditions are also commonly referred to as brownout, and are defined as AC line voltage drops below nominal voltage conditions. Surge is defined as AC line voltage rises above nominal voltage conditions. The power supply meets requirements under the following AC line sag and surge conditions.
Table 71. AC Line Sag Transient Performance Duration Continuous 0 to 1 AC cycle > 1 AC cycle Sag 10% 100% > 10% Operating AC Voltage Nominal AC Voltage ranges Nominal AC Voltage ranges Nominal AC Voltage ranges Line Frequency 50/60Hz 50/60Hz 50/60Hz Loading 100% 60% 100% Performance Criteria No loss of function or performance No loss of function or performance Loss of function acceptable, self recoverable

Table 72. AC Line Surge Transient Performance Duration Continuous 0 to AC cycle Surge 10% 30% Operating AC Voltage Nominal AC Voltages Mid-point of nominal AC Voltages Line Frequency 50/60Hz 50/60Hz Performance Criteria No loss of function or performance No loss of function or performance

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2.4.5.3

Susceptibility Requirements

The power supply meets the following electrical immunity requirements when connected to a cage with an external EMI filter that meets the criteria defined in the SSI document EPS Power Supply Specification.
Table 73. Performance Criteria Level A B C Description The apparatus shall continue to operate as intended. No degradation of performance. The apparatus shall continue to operate as intended. No degradation of performance beyond spec limits. Temporary loss of function is allowed provided the function is selfrecoverable or can be restored by the operation of the controls.

2.4.5.3.1

Electrostatic Discharge Susceptibility

The power supply complies with the limits defined in EN 55024: 1998 using the IEC 61000-42:1995 test standard and performance criteria B defined in Annex B of CISPR 24. 2.4.5.3.2 Fast Transient/Burst

The power supply complies with the limits defined in EN55024: 1998 using the IEC 61000-44:1995 test standard and performance criteria B defined in Annex B of CISPR 24. 2.4.5.3.3 Radiated Immunity

The power supply complies with the limits defined in EN55024: 1998 using the IEC 61000-43:1995 test standard and performance criteria A defined in Annex B of CISPR 24. 2.4.5.3.4 Surge Immunity

The power supply is tested with the system for immunity to AC Ringwave and AC Unidirectional wave, both up to 2kV, per EN 55024:1998, EN 61000-4-5:1995 and ANSI C62.45: 1992. The pass criteria include: no unsafe operation is allowed under any condition; all power supply output voltage levels must stay within proper specification levels; no change in operating state or loss of data during and after the test profile; no component damage under any condition. The power supply complies with the limits defined in EN55024: 1998 using the IEC 61000-45:1995 test standard and performance criteria B defined in Annex B of CISPR 24.

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2.4.5.4

AC Line Fast Transient (EFT) Specification

The power supply meets the EN61000-4-5 directive and any additional requirements in IEC1000-4-5: 1995 and the Level 3 requirements for surge-withstand capability, with the following conditions and exceptions: These input transients do not cause any out-of-regulation conditions, such as overshoot and undershoot, nor do they cause any nuisance trips of any of the power supply protection circuits. The surge-withstand test must not produce damage to the power supply. The supply meets surge-withstand conditions under maximum and minimum DC-output load conditions. 2.4.5.5 AC Line Dropout / Holdup
Table 74. AC Line Dropout / Holdup Output Wattage 1000W 75% Loading Holdup time 20 ms

An AC line dropout is defined to be when the AC input drops to 0VAC at any phase of the AC line for any length of time. During an AC dropout, the power supply meets dynamic voltage regulation requirements. An AC line dropout of any duration does not cause any tripping of control signals or protection circuits. If the AC dropout lasts longer than the hold-up time, the power recovers and meets all turn-on requirements. The power supply meets the AC dropout requirement over rated AC voltages and frequencies. A dropout of the AC line for any duration does not cause damage to the power supply. 2.4.5.5.1 AC Line 5VSB Holdup

The 5VSB output voltage stays in regulation under its full load (static or dynamic) during an AC dropout of 70ms min (=5VSB holdup time) whether the power supply is in the ON or OFF state (PSON asserted or de-asserted). 2.4.5.6 Power Recovery

The power supply recovers automatically after an AC power failure. AC power failure is defined to be any loss of AC power that exceeds the dropout criteria. 2.4.5.6.1 Voltage Brownout

The power supply complies with the limits defined in EN55024: 1998 using the IEC 61000-411:1995 test standard and performance criteria C defined in Annex B of CISPR 24. In addition, the power supply meets the following Intel Requirement:

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A continuous input voltage below the nominal input range shall not damage the power supply or cause overstress to any power supply component. The power supply must be able to return to normal power up state after a brownout condition. Maximum input current under a continuous brownout shall not blow the fuse. The power supply should tolerate a 3min ramp from 90VAC voltage to 0VAC after the components have reached a steady state condition. Voltage Interruptions

2.4.5.6.2

The power supply complies with the limits defined in EN55024: 1998 using the IEC 61000-411:1995 test standard and performance criteria C defined in Annex B of CISPR 24. 2.4.5.7 AC In-rush

AC line in-rush current does not exceed 50A peak, cold start at 20 degrees C, and no component is damaged at hot start for up to one-quarter of the AC cycle, after which, the input current is no more than the specified maximum input current listed in Table 70. The peak inrush current is less than the ratings of its critical components (including input fuse, bulk rectifiers, and surge limiting device). The power supply meets the in-rush requirements for any rated AC voltage during turn on at any phase of AC voltage or during a single cycle AC dropout condition, as well as upon recovery after AC dropout of any duration, and over the specified temperature range (Top). 2.4.5.8 AC Line Isolation Requirements

The power supply meets all safety agency requirements for dielectric strength. Transformers isolation between primary and secondary windings complies with the 3000Vac (4242Vdc) dielectric strength criteria. In addition, the insulation system complies with reinforced insulation per safety standard IEC 950. Separation between the primary and secondary circuits, and primary to ground circuits, complies with the IEC 950 spacing requirements. 2.4.5.9 AC Line Leakage Current

The maximum leakage current to ground for each power supply is 3.5mA when tested at 240VAC.

2.4.5.10

AC Line Fuse

The power supply has one line fused in the single line fuse on the Line (Hot) wire of the AC input. The line fusing is acceptable for all safety agency requirements. The input fuse is a slow blow type. AC in-rush current does not cause the AC line fuse to blow under any conditions. All protection circuits in the power supply do not cause the AC fuse to blow unless a component in the power supply has failed. This includes DC output load short conditions.

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2.4.5.11

Power Factor Correction

The power supply incorporates a power factor correction circuit. The power supply is tested as described in EN 61000-3-2: Electromagnetic Compatibility (EMC Part 3: Limits Section 2: Limits for harmonic current emissions, and meets the harmonic current emissions limits specified for ITE equipment. The power supply is tested as described in JEIDA MITI Guideline for Suppression of High Harmonics in Appliances and General-Use Equipment, and meets the harmonic current emissions limits specified for ITE equipment. 2.4.5.12 Efficiency

The following table provides the required minimum efficiency level at various loading conditions. These efficiency levels are provided at three different load levels: 100%, 50% and 20%. Efficiency is tested over an AC input voltage range of 115VAC to 220VAC.
Table 75. Efficiency Loading Recommended Efficiency 100% of Maximum 80% 50% of Maximum 80% 20% of Maximum 80%

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2.4.6

DC Output Specification
Table 76. Cable Lengths From Length (mm) 850 350 500 350 650 650 350 100 800 75 800 75 To Connector # P1 P2 P3 P4 P5 P6 P9 P10 P11 P12 P13 P14 Number of Pins 24 8 8 5 6 6 4 4 4 4 5 5 Description Baseboard Power Connector Processor 1 Power Connector Processor 2 Power Connector Power PSMI Connector PCIE Graphics card Power Connector PCIE Graphics card Power Connector Peripheral Power Connector Peripheral Power Connector Peripheral Power Connector Right-angle SATA Power Connector Right Angel SATA Power Connector SATA Power Signal Connector

Power Supply cover exit hole Power Supply cover exit hole Power Supply cover exit hole Power Supply cover exit hole Power Supply cover exit hole Power Supply cover exit hole Power Supply cover exit hole Extension Power Supply cover exit hole Extension Power Supply cover exit hole Extension

2.4.7
2.4.7.1

Power Connectors
Baseboard Power Connector (P1)

Connector housing: 24-pin Molex* Mini-Fit Jr. 39-01-2245 or equivalent Contact: Molex* Mini-Fit, HCS, Female, Crimp 44476 or equivalent
Table 77. P1 Baseboard Power Connector Pin 1* Signal +3.3 VDC 3.3V RS 2 3* 4* Revision 1.0 +3.3 VDC COM +5 VDC 18 AWG Color Orange Orange (24AWG) Orange Black Red Pin 13 14 15 16 17 Intel Confidential Signal +3.3 VDC* -12 VDC COM PSON# COM 18 AWG Color Orange Blue Black Green Black 81

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Intel Server Chassis SC5650 TPS

Pin

Signal 5V RS

18 AWG Color Red (24AWG) Black Red Black Gray Purple Yellow Yellow (24AWG) Yellow Orange

Pin 18 19 20 21 22 23 24

Signal COM COM Reserved +5 VDC +5 VDC +5 VDC COM

18 AWG Color Black Black N.C. Red Red Red Black

5 6 7 8 9 10

COM +5 VDC COM PWR OK 5VSB +12V3 +12V3 RS

11 12
Notes:

+12V3 +3.3 VDC

5V Remote Sense Double Crimped into pin 4. 3.3V Locate Sense Double Crimped into pin 2.

2.4.7.2

Processor 1 Power Connector (P2)

Connector housing: 8-pin Molex* 39-01-2080 or equivalent Contact: Molex* 39-00-0059 or equivalent
Table 78. P2 Processor 1 Power Connector Pin 1 2 3 4 Signal COM COM COM COM 18 AWG Color Black Black Black Black Pin 5 6 7 8 Signal +12V1 +12V1 +12V1 +12V1 18 AWG Color White White White White

2.4.7.3

Processor 2 Power Connector (P3)

Connector housing: 8-pin Molex* 39-01-2080 or equivalent Contact: Molex* 39-00-0059 or equivalent

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Table 79. P3 Processor 2 Power Connector Pin 1 2 3 4 Signal COM COM COM COM 18 AWG Color Black Black Black Black Pin 5 6 7 8 Signal +12V2 +12V2 +12V2 +12V2 18 AWG Color White White White White

2.4.7.4

Power Signal Connector (P4)

Connector housing: 5-pin Molex* 50-57-9405 or equivalent Contacts: Molex* 16-02-0087 or equivalent
Table 80. P4 Power Signal Connector Pin 1 2 3 4 5 Signal I2C Clock I2C Data Reserved COM 3.3RS 24 AWG Color White Yellow N.C. Black Orange

2.4.7.5

PCI Express Connector (P5)

Connector housing: 6-pin Molex* 455590002 or equivalent Contacts: Molex* Mini-Fit, HCS, Female, Crimp 44476
Table 81. P5 PCI Express Connector PIN 1 2 3 SIGNAL +12V4 +12V4 +12V4 18 AWG Colors Green/Yellow strip Green/Yellow strip Green/Yellow strip PIN 4 5 6 SIGNAL COM COM COM 18 AWG Colors Black Black Black

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2.4.7.6

PCI Express Connector (P6)

Connector housing: 6-pin Molex* 455590002 or equivalent Contacts: Molex* Mini-Fit, HCS, Female, Crimp 44476
Table 82. P6 PCI Express Connector PIN 1 2 3 SIGNAL +12V4 +12V4 +12V4 18 AWG Colors Green/Yellow strip Green/Yellow strip Green/Yellow strip PIN 4 5 6 SIGNAL COM COM COM 18 AWG Colors Black Black Black

2.4.7.7

Peripheral Power Connectors (P9-P12)

Connector housing: Amp* 1-480424-0 or equivalent Contact: Amp* 61314-1 contact or equivalent
Table 83. P9-P12 Peripheral Power Connectors Pin 1 2 3 4 Signal +12 V5 COM COM +5 VDC 18 AWG Color Green Black Black Red

2.4.7.8

Right-Angle SATA Power Connector (P13)

Connector housing: JWT* F6002HS0-5P-18 or equivalent


Table 84. P13 Right-angle SATA Power Connector Pin 1 2 3 4 Signal +3.3V COM +5 VDC COM 18 AWG Color Orange Black Red Black

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Pin 5

Signal +12V5

18 AWG Color Green

2.4.7.9

SATA Power Connector (P14)

Connector housing: JWT* A3811H00-5P or equivalent; Contact: JWT* A3811TOP-0D or equivalent


Table 85. P14 SATA Power Connector Pin 1 2 3 4 5 Signal +3.3VDC COM +5VDC COM +12V5 18 AWG Color Orange Black Red Black Green

2.4.8
2.4.8.1

DC Output Specifications
Output Power / Currents

The following table defines the power and current ratings for the 1000-W power supply. The combined output power of all outputs does not exceed the rated output power. The power supply meets both static and dynamic voltage regulation requirements for the minimum loading conditions.
Table 86. Load Ratings Voltage +3.3V +5V +12V1 +12V2 +12V3 +12V4 +12V5 Revision 1.0 Minimum Continuous 1.0 A 2.0 A 0.5 A 1.0 A 0.5 A 0.5 A 0.5A Maximum Continuous 24 A 30 A 24 A 24 A 16 A 16 A 16A Intel Confidential 85 27 A 27 A 318 A 18 A Peak Load

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Voltage +5VSB

Minimum Continuous 0.1 A

Maximum Continuous 5.0 A

Peak Load 6A

Notes: 1. Maximum continuous total DC output power should not exceed 1000 W. 2. Maximum continuous load on the combined 12V output shall not exceed 80 A. 3. Peak load on the combined 12V output shall not exceed 70 A. 4. Peak total DC output power should not exceed 1150 W. 5. Peak power and current loading shall be supported for a minimum of 12 seconds. 6. Combined 3.3V and 5V power shall not exceed 170 W.

2.4.8.2

Pre-set Power-on Requirement

When the power supply turns on, system loading may be very light before it comes out of reset. Under these conditions, the power supplys output voltage regulation may be relaxed to +/-10% on the 3.3V and 5V rails and +10 / -8% on the +12V rails. When the power supply is subsequently loaded, it must begin to regulate and source current without fault.
Table 87. Pre-set Lighter Load Voltage +3.3V +5V +12V1 +12V2 +12V3 +12V4 +12V5 -12V +5VSB Minimum Continuous Load 0A 0A 0.0 A 0.0 A 0.1 A 0.0 A 0.1A 0A 0.1 A Maximum Continuous Load 9.0 A 7.0 A 8.0 A 8.0 A 8.0 A 8.0 A 8.0A 0.5 A 3.0 A Peak Load

Table 88. Pre-set Lighter Voltage Regulation Limits Parameter +3.3V Tolerance - 10% / +10% MIN +2.970 NOM +3.30 MAX +3.630 Units Vrms

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Parameter +5V +12V1 +12V2 +12V3 +12V4 +12V5 - 12V +5VSB

Tolerance - 10% / +10% - 8% / +10% - 8% / +10% - 8% / +10% - 8% / +10% - 8% / +10% - 5% / +9% - 5% / +5%

MIN +4.500 +11.04 +11.04 +11.04 +11.04 +11.04 - 11.40 +4.75

NOM +5.00 +12.00 +12.00 +12.00 +12.00 +12.00 -12.00 +5.00

MAX +5.500 +13.20 +13.20 +13.20 +13.20 +13.20 -13.08 +5.25

Units Vrms Vrms Vrms Vrms Vrms Vrms Vrms Vrms

2.4.8.3

Grounding

The output ground of the pins of the power supply provides the power return path. The output connector ground pins are connected to safety ground (power supply enclosure). This grounding is designed to ensure passing the maximum allowed common mode noise levels. 2.4.8.4 Standby Output

The 5VSB output is present when an AC input greater than the power supply turn-on voltage is applied. 2.4.8.5 Remote Sense

The power supply has remote sense return (ReturnS) to regulate out ground drops for all output voltages: +3.3V, +5V, +12V1, +12V2, +12V3, +12V4, +12V5, -12V, and 5VSB. The power supply uses remote sense to regulate out drops in the system for the +3.3V outputs. The +5V, +12V1, 12V and 5VSB outputs only use remote sense referenced to the ReturnS signal. The remote sense input impedance to the power supply is greater than 200 on 3.3V, 5VS. This is the value of the resistor connecting the remote sense to the output voltage internal to the power supply. Remote sense is able to regulate out a minimum of a 200mV drop on the 3.3 output. The remote sense return (ReturnS) is able to regulate out a minimum of a 200mV drop in the power ground return. The current in any remote sense line is less than 5mA to prevent voltage sensing errors. The power supply operates within specification over the full range of voltage drops from the power supplys output connector to the remote sense points. 2.4.8.6 Voltage Regulation

The power supply output voltages stay within the following voltage limits when operating at steady state and dynamic loading conditions. These limits include the peak-peak ripple/noise.

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Intel Server Chassis SC5650 TPS Table 89. Voltage Regulation Limits

Parameter + 3.3V + 5V + 12V1 + 12V2 +12V3 +12V4 +12V5 - 12V + 5VSB

Tolerance - 5% / +5% - 5% / +5% - 5% / +5% - 5% / +5% - 5% / +5% - 5% / +5% - 5% / +5% - 5% / +9% - 5% / +5%

MIN +3.14 +4.75 +11.40 +11.40 +11.40 +11.40 +11.40 -10.80 +4.75

NOM +3.30 +5.00 +12.00 +12.00 +12.00 +12.00 +12.00 -12.00 +5.00

MAX +3.46 +5.25 +12.60 +12.60 +12.60 +12.60 +12.60 -13.20 +5.25

Units Vrms Vrms Vrms Vrms Vrms Vrms Vrms Vrms Vrms

2.4.8.7

Dynamic Loading

The output voltages remain within limits specified for the step loading and capacitive loading, as shown in the following table. The load transient repetition rate is tested between 50 Hz and 5 kHz at duty cycles ranging from 10%-90%. The load transient repetition rate is only a test specification. The step load may occur anywhere between the MIN load and MAX load conditions.
Table 90. Transient Load Requirements Output +3.3V +5V +12V +5VSB
1. 2.

Step Load Size12 7.0A 7.0A 25A 0.5A

Load Slew Rate 0.25 A/sec 0.25 A/sec 0.25 A/sec 0.25 A/sec

Test Capacitive Load 4700 F 1000 F 4700 F 20 F

Step loads on each 12V output may happen simultaneously. The +12V should be tested with 2200F evenly split between the four +12V rails.

2.4.8.8

Capactive Loading

The power supply is stable and meets all requirements with the following capacitive loading ranges.

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Intel Server Chassis SC5650 TPS Table 91. Capacitive Loading Conditions Output +3.3V +5V +12V(1, 2, 3, 4,5) -12V +5VSB MIN 250 400 500 each 1 20 MAX 6800 4700 11,000 350 350 Units F F F F F

Power Sub-system

2.4.8.9

Closed Loop Stability

The power supply is unconditionally stable under all line / load / transient load conditions, including capacitive load ranges. A minimum of 45 degrees phase margin and -10dB-gain margin are required. Closed-loop stability is ensured at the maximum and minimum loads, as applicable. 2.4.8.10 Common Mode Noise

The common mode noise on any output does not exceed 350mV pk-pk over the frequency band of 10Hz to 30MHz. 2.4.8.11 Ripple / Noise

The maximum allowed ripple / noise output of the power supply is defined in the following table. This is measured over a bandwidth of 10Hz to 20MHz at the power supply output connectors. A 10F tantalum capacitor, in parallel with a 0.1F ceramic capacitor, is placed at the point of measurement.
Table 92. Ripple and Noise +3.3V 50mVp-p +5V 50mVp-p +12V (1,2,3,4,5) 120mVp-p -12V 120mVp-p +5VSB 50mVp-p

2.4.8.12

Soft Starting

The power supply contains a control circuit that provides monotonic soft start for its outputs without overstressing the AC line or any power supply components at any specified AC line or load conditions. There is no requirement for rise time on the 5Vstby but the turn on/off is monotonic.

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2.4.8.13

Timing Requirements

The timing requirements for power supply operation are as follows. The output voltages must rise from 10% to within regulation limits (Tvout_rise) within 5 to 70 ms, except for 5VSB, which is allowed to rise from 1.0 to 25 ms. The +3.3V, +5V and +12V output voltages should start to rise approximately at the same time. All outputs must rise monotonically. Each output voltage shall reach regulation within 50ms (Tvout_on) of each other during turn on of the power supply. Each output voltage shall fall out of regulation within 400msec (Tvout_off) of each other during turn off. The following table shows the timing requirements for the power supply being turned on and off via the AC input, with PSON held low and the PSON signal, with the AC input applied.
Table 93. Output Voltage Timing Item Tvout_rise Tvout_on T vout_off Description Output voltage rise time from each main output. All main outputs must be within regulation of each other within this time. All main outputs must leave regulation within this time. MIN 5.01 MAX 701 50 400 Units msec msec msec

1. The 5VSB output voltage rise time shall be from 1.0 ms to 25 ms.

Vout

V1

10% Vout

V2

V3

V4

Tvout

rise

Tvout_off

Tvout_on

Figure 19. Output Voltage Timing

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Intel Server Chassis SC5650 TPS Table 94. Turn On / Off Timing Item Tsb_on_delay Tac_on_delay Tvout_holdup Tpwok_holdup Tpson_on_delay Tpson_pwok Tpwok_on Tpwok_off Tpwok_low Tsb_vout T5VSB_holdup Description Delay from AC being applied to 5VSB being within regulation. Delay from AC being applied to all output voltages being within regulation. Time all output voltages stay within regulation after loss of AC. Delay from loss of AC to de-assertion of PWOK Delay from PSON# active to output voltages within regulation limits. Delay from PSON# deactive to PWOK being deasserted. Delay from output voltages within regulation limits to PWOK asserted at turn on. Delay from PWOK de-asserted to output voltages (3.3V, 5V, 12V, -12V) dropping out of regulation limits. Duration of PWOK being in the de-asserted state during an off / on cycle using AC or the PSON signal. Delay from 5VSB being in regulation to O/Ps being in regulation at AC turn on. Time the 5VSB output voltage stays within regulation after loss of AC. 100 1 100 50 70 21 20 5 Minimum

Power Sub-system

Maximum 1500 2500

Units ms ms ms ms

400 50 500

ms ms ms ms ms ms ms

1000

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AC Input

Tvout_holdup

Vout

TAC_on_delay Tsb_on_delay PWOK Tpwok_on Tpwok_holdup Tpwok_off

Tpwok_low Tsb_on_delay Tpwok_on Tpwok_off Tpson_pwok

5VSB

Tsb_vout

T5VSB_holdup
Tpson_on_delay

PSON

AC turn on/off cycle

PSON turn on/off cycle

Figure 20. Turn On/Off Timing (Power Supply Signals)

2.4.8.14

Residual Voltage Immunity in Standby mode

The power supply is immune to any residual voltage placed on its outputs (typically a leakage voltage through the system from standby output) up to 500mV. There is no additional heat generated or stress of any internal components with this voltage applied to any individual output, or to all outputs simultaneously. Residual voltage also does not trip the power supply protection circuits during turn on. Residual voltage at the power supply outputs for a no-load condition does not exceed 100mV when AC voltage is applied and the PSON# signal is de-asserted. 2.4.8.15 Protection Circuits

Protection circuits inside the power supply cause only the power supplys main outputs to shut down. If the power supply latches off due to a protection circuit tripping, an AC cycle OFF for 15 sec and a PSON# cycle HIGH for 1 sec will reset the power supply. 2.4.8.16 Over-current Protection (OCP)

The power supply has a current limit to prevent the +3.3V, +5V, and +12V outputs from exceeding the values shown in the following table. If the current limits are exceeded the power supply will shut down and latch off. The latch will be cleared by toggling the PSON# signal or by an AC power interruption. The power supply will not be damaged from repeated power cycling in this condition. -12V and 5VSB are protected under over-current or shorted conditions so that

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no damage can occur to the power supply. The 5VSB will auto recover after removing the OCP limit.
Table 95. Over-current Protection (OCP) 240VA Over-current Limit MIN +3.3V +5V +12V1 +12V2 +12V3 +12V4 +12V5 -12V 5VSB 110% = 26.4A 110% = 33A 18A 18A 18A 18A 18A 0.625A 7.0A MAX 150% = 36A 150% = 45A 20A 20A 20A 20A 20A 4.0A Peak Load Peak Limit Delay

Voltage

2.4.8.17

Over-voltage Protection (OVP)

The power supply over-voltage protection is locally sensed. The power supply will shut down and latch off after an over voltage condition occurs. This latch can be cleared by toggling the PSON# signal or by an AC power interruption. The following table contains the over-voltage limits. The values are measured at the output of the power supplys pins. The voltage never exceeds the maximum levels when measured at the power pins of the power supply connector during any single point of fail. The voltage will not trip any lower than the minimum levels when measured at the power pins of the power supply connector. Exception: The +5VSB rail will auto-recover after an OVP has been cleared.
Table 96. Over-voltage Protection Limits Output Voltage +3.3V +5V +12V1,2, 3, 4,5 -12V +5VSB MIN (V) 3.9 5.7 13.3 -13.3 5.7 MAX (V) 4.5 6.5 14.5 -16 6.5

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2.4.8.18

Over-temperature Protection (OTP)

The power supply is protected against over-temperature conditions caused by loss of fan cooling or excessive ambient temperature. In an OTP condition the power supply will shut down. When the power supply temperature drops to within specified limits, the power supply will restore power automatically; the 5VSB always remains on. The OTP circuit has a built-in hysteresis such that the power supply will not oscillate on and off due to a temperature recovering condition. The OTP trip level has a minimum of 4 degrees C of ambient temperature hysteresis.

2.4.9

Control and Indicator Functions

The following sections define the input and output signals from the power supply. Signals that can be defined as low true use the following convention: Signal# = low true 2.4.9.1
#

PSON# Input Signal

The PSON signal is required to remotely turn on/off the power supply. PSON# is an active low signal that turns on the +3.3V, +5V, +12V, and -12V power rails. When this signal is not pulled low by the system, or left open, the outputs (except the +5VSB) turn off. This signal is pulled to a standby voltage by a pull-up resistor internal to the power supply.
Table 97. PSON# Signal Characteristic Signal Type Accepts an open collector/drain input from the system. Pull-up to VSB located in power supply. ON OFF MIN Logic level low (power supply ON) Logic level high (power supply OFF) Source current, Vpson = low Power up delay: PWOK delay: Tpson_on_delay T pson_pwok 5msec 0V 2.1V MAX 1.0V 5.25V 4mA 400msec 50msec

PSON# = Low PSON# = High or Open

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2.4.9.2 PWOK (Power OK) Output Signal PWOK is a power OK signal and is pulled HIGH by the power supply to indicate that all the outputs are within the regulation limits of the power supply. When any output voltage falls below regulation limits or when AC power has been removed for a time sufficiently long so that power supply operation is no longer guaranteed, PWOK will de-assert to a LOW state. The start of the PWOK delay time is inhibited as long as any power supply output is in current limit.
Table 98. PWOK Signal Characteristics Signal Type Open collector/drain output from power supply. Pull-up to VSB located in system. Power OK Power Not OK MIN Logic level low voltage, Isink=4mA Logic level high voltage, Isource=200A Sink current, PWOK = low Source current, PWOK = high PWOK delay: Tpwok_on PWOK rise and fall time Power down delay: T pwok_off 1ms 100ms 0V 2.4V MAX 0.4V 5.25V 4mA 2mA 1000ms 100sec 200msec

PWOK = High PWOK = Low

2.4.9.3

LED

There is a single bi-color LED to indicate power supply status. LED operation is defined in the following table.
Table 99. LED Indicators Power Supply Condition No AC power to all power supplies Power supply critical event causing a shutdown: failure, OCP, OVP, fan fail AC present / Only 5VSB on (power supply off) Output ON and OK LED Off Amber 1-Hz blink Green Green

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The LED is visible on the power supplys exterior face. The LEDs location meets ESD requirements. The LED is securely mounted in such a way that incidental pressure on the LED will not cause it to be displaced.

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3.
3.1

Chassis Cooling
Fan Configuration

The cooling sub-system of the Intel Server Chassis SC5650 consists of one 120mm chassis fan, one 120mm PCI fan and one 92mm drive bay fan. The 4-wire chassis fan provides cooling at the rear of the chassis by drawing fresh air into the chassis from the front and exhausting warm air out the system. This fan is PWM controlled. The server board monitors several temperature sensors and adjusts the duty cycle of the PWM signal to drive the fan at the appropriate speed. The 4-wire PCI fan behind the PCI card guide provides cooling by drawing fresh air from the front of the chassis through PCI fan guide and exhausting it into the PCI bay area. The 4-wire 92-mm drive bay fan provides additional cooling to the drive bay by drawing fresh air from the front of the chassis through drive bay area and exhausting warm air out the bay area. Removal and insertion of the two 120-mm fans or 92-mm fan can be done without tools. The power supply internal fan assists in drawing air through the peripheral bay area, through the power supply and exhausting it out the rear of the chassis. All versions of the Intel Server Chassis SC5650 are optimized for server and workstation boards that have an active CPU heatsink solution. If an optional hot-swap drive bay is installed, a 4-wire 92-mm fan is included with the mounting bracket kit for installation onto the drive bay. This fan has a PWM circuit that allows the server board to control the fan speed based on sensor readings of ambient temperature. The front panel of the Intel Server Chassis SC5650 provides a TMP75 temperature sensor for BMC control. Server boards that support BMC control may use the TMP75 sensor to adjust fan speeds according to air intake temperatures. Refer to the server board documentation for configuring use of the front panel sensor.

3.2

Server Board Fan Control

The fans provided in the Intel Server Chassis SC5650 contain a tachometer signal that can be monitored by the server management subsystem for the Intel Server Boards S5500BC, S5520HC, S5500HCV and S5520SC. See the specific server board Technical Product Specification for details on how this feature works.

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3.3

Cooling Solution

Air should flow through the system from front to back, as indicated by the arrows in the following figure.

Figure 21. Cooling Fan Configuration for Intel Server Boards S5520HC/S5500HCV/S5520SC above and S5500BC below

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Chassis Cooling

The Intel Server Chassis SC5650 is engineered to provide sufficient cooling for all internal components of the server. The cooling subsystem is dependent upon proper airflow. The designated cooling vents on both the front and back of the chassis must be left open and must not be blocked by improperly installed devices. All internal cables must be routed in a manner that does not impede airflow, and ducting provided for CPU cooling must be installed. Active heatsinks for CPUs incorporate a fan to provide cooling. This thermal solution is included with some boxed Intel Xeon processors. The Intel Server Chassis SC5650 is engineered to work with processors that have an active heatsink solution. Proper installation of the processor cooling solution is required for circulating air toward the rear of the chassis (toward I/O connectors).

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4.

Peripheral and Hard Drive Support

A. Hard Disk Drive Bay Figure 22. Drive Bay Locations for Intel Server Chassis SC5650 (DP/WS/BRP configuration shown)

4.1

3.5-inch Peripheral Drive Bay

The Intel Server Chassis SC5650 supports one 3.5-inch removable media peripheral, such as a floppy or tape drive, below the 5.25-inch peripheral bays. The bezel must be removed prior to 3.5-inch removable media installation. When a drive is not installed, a snap-in EMI shield must be in place to ensure regulatory compliance. A cosmetic plastic filler is provided to snap into the bezel. The 3.5-inch bay is designed for tool-less insertion and removal so that no screws are required. On the right side of the chassis, two protrusions in the sheet metal help locate the drive. On the left side are two levers to lock the drive into place.

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4.2

5.25-inch Peripheral Drive Bays

The Intel Server Chassis SC5650 supports two half-height 5.25-inch removable media peripheral devices, such as a magnetic/optical disk, CD-ROM drive, or tape drive. These peripherals can be up to 9 inches (228.6 mm) deep on the non-redundant power chassis. The 600-W redundant power supply is longer in length and will limit the drives to approximately 7.5inch maximum length. As a guideline, the maximum recommended power per device is 17W. Thermal performance of specific devices must be verified to ensure compliance to the manufacturers specifications. The 5.25-inch peripherals can be inserted and removed without tools from the front of the chassis after taking off the access cover and removing the front bezel. The peripheral bay utilizes visual guide holes to correctly line up the position of peripheral drives. Locking slide levers push retaining pins into the drive to hold the drive securely in the bay. EMI shield panels are installed and should be retained in unused 5.25-inch bays to ensure proper cooling and EMI conformance. Note: Use caution when approaching the maximum level of integration for the 5.25-inch drive bays. Power consumption of the devices integrated needs must be carefully considered to ensure that the maximum power levels of the power supply are not exceeded.

4.3

Hot Swap Hard Disk Drive Bays

The chassis can support either an active SAS/SATA or a passive SAS/SATA backplane. The backplanes provide platform support for hot-swap SAS or SATA hard drives. The passive backplane acts as a pass-through for the SAS/SATA data from the drives to the SAS/SATA controller on the baseboard or a SAS/SATA controller add-in card. It provides the physical requirements for the hot-swap capabilities. The active backplane has a built-in SAS controller that requires a SAS controller on the baseboard or a SAS add-in card for communication. The active SAS/SATA backplane reduces the number of required cables by using only two SAS/SATA connectors to drive up to six hard drives. When the hot swap drive bay is installed, a bi-color hard drive LED is located on each drive carrier to indicate specific drive failure or activity. For pedestal systems, these LEDs are visible upon opening the front bezel door.

4.3.1

Fixed Hard Drive Bay

The Intel Server Chassis SC5650 comes with a removable hard drive bay that can accept up to six cabled 3.5-inch x 1-inch hard drives. Power requirements for each individual hard drive may limit the maximum number of drives that can be integrated into an Intel Server Chassis SC5650. The drive bay is designed to allow adequate airflow between drives, and no additional cooling fan is required. Drives must be installed in the order of slot 1, 3, 5 first (skipping slots) to ensure proper cooling. The drive bay is secured with a tool-less retention mechanism. Note: The hard drive bay must be pushed forward or removed to install the server board.

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The Intel Server Chassis SC5650 is capable of accepting a single SAS/SATA hot swap backplane hard drive enclosure in place of the fixed drive bay. Both backplanes (expanded and non-expanded) have a connector to accommodate a SAF-TE controller on an add-in card. Each backplane type supports up to six 1-in hot swap drives when mounted in the docking drive carrier.

4.3.2

Intel Server Chassis SC5650 6HDD Passive SAS/SATA Hot Swap Back
Plane (HSBP) Overview

The Intel Server Chassis SC5650 6HDD Passive SAS/SATA Hot Swap Backplane (HSBP) is a monolithic printed circuit board. The architecture is based on the Vitesse* Server Board and storage management controller VSC410* and supports up to four or six SAS/SATA drives. The 6HDD SAS/SATA HSBP supports the following feature set. Vitesse* Server Board and storage management controller VSC410 Serial flash memory I2C EEPROM Temperature Sensor Four I2C interfaces

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One Vitesse* SFF8485 (SGPIO) Interface Compliance with SCSI Accessed Fault Tolerant Enclosures (SAF-TE) specification, version 1.00 and addendum Compliance with SCSI Enclosure Service (SES) specification. Compliance with Intelligent Platform Management Interface (IPMI) 1.5. Support for up to four or six SAS1.5/3.0Gbps, SATA I or SATA II Drives Hot swap drive support Two 4-pin standard hard drive power connectors The following figure shows the functional blocks of the passive 6HDD SAS/SATA HSBP.

Figure 23. 6HDD Passive SAS/SATA HSBP Block Diagram

4.3.3

Server Board and Storage Management Controller VSC410*

The Vitesse* VSC410 baseboard and storage management controller for the SAS/SATA backplane monitors various aspects of the storage enclosure. The chip provides out-of-band SAF-TE, SES management through the SAS/SATA Host I2C interface and HDD fault LED status management through the SGPIO interface. The VSC410* also supports the IPMI specification by providing management data to a server board management controller through the IPMB.

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The VSC410* controller has many general purpose input and output pins (GPIOs) that allow customization. Some of these GPIOs are used for hard disk drive detection and driving hard disk drive fault LEDs. The VSC410* controller comes in a 64-pin Low Profile Quad Flat Pack (LQFP) package, operates from 3.3V and has an input clock frequency of 4MHz. 4.3.3.1 I2C Serial Bus Interface

The VSC410* controller supports four independent I2C interfaces with bus speed of up to 400 Kbits. The I2C bus 0 supports an AT24C64* EEPROM or equivalent I2C -based EEPROM used as FRU. The I2C bus 1 supports a TI TMP75* or equivalent I2C -based temperature sensor. This enables actual temperature value readings to be returned to the host. The Intelligent Platform Management Bus (IPMB) is supported through the I2C port 2. The SCSI Enclosure Service (SES) interface is supported through the I2C port 3. The following figure provides a block diagram of I2C bus connection implemented on the 6HDD passive SAS/SATA HSBP.

Figure 24. Passive SAS/SATA HSBP I2C Bus Connection Diagram

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4.3.3.2

I2C Bus Address and Loading


Table 100. I2C Bus Addressing

TMP75* I2C Address 90h A0h

AT24C64* I2C Address

VSC410* I2C port2 C0h or C2h

Table 101. 6HDD I2C Bus Loading Device Powe r Well ViH ViL VoL Ileak CAP I2C Addres s 90h I2C Bus Name

TMP75* VSC410* AT24C64* VSC410* VSC410*

P3V3 0.7VCC 0.3VCC P3V3 2.0V 0.8V

0.4V/3mA 0.4V/4mA

1uA 10uA

3PF

SMB_LOCAL_CLK SMB_LOCAL_DAT SMB_LOCAL_CLK SMB_LOCAL_DAT

P3V3 0.7VCC 0.3VCC 0.4V/2.1mA 3uA P3V3 P3V3 2.0V 2.0V 0.8V 0.8V 0.4V/4mA 0.4V/4mA 10uA 10uA

8PF

A0h

SMB_EEPROM_CLK SMB_EEPROM_DAT SMB_EEPROM_CLK SMB_EEPROM_DAT

C0h or C2h

SMB_3V3_IPMB_CLK SMB_3V3_IPMB_DAT SMB_3V3_IPMB_CLK SMB_3V3_IPMB_DAT SMB_5VSTB_IPMB_CLK SMB_5VSTB_IPMB_DA T

MMBF170(S)* P3V3 MMBF170(D) * J4D1 P5V

P5V

0.7VCC 0.3VCC

0.4V/3mA

10uA 4/8P

SMB_5VSTB_IPMB_CLK SMB_5VSTB_IPMB_DA T SMB_3V3_I2C_CLK SMB_3V3_I2C_DAT SMB_3V3_I2C_CLK SMB_3V3_I2C_DAT SMB_HBA_I2C_CLK SMB_HBA_I2C_DAT

VSC410*

P3V3

2.0V

0.8V

0.4V/4mA

10uA

MMBF170(S)* P3V3 MMBF170(D) * J4E3 P5V P5V 0.7VCC 0.3VCC 0.4V/3mA 10uA 4/8P

SMB_HBA_I2C_CLK SMB_HBA_I2C_DAT

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4.3.3.3

Temperature Sensor

The 6HDD passive SAS/SATA HSBP provides a TI TMP75* or equivalent temperature sensor. The host can query the TMP75* at any time to read the temperature. The temperature sensor has an I2C address of 0x90h on Port 1 of the VSC410* controller. 4.3.3.4 Serial EEPROM

The 6HDD SAS/SATA HSBP provides an Atmel AT24C64* or equivalent serial EEPROM for storing the FRU information. The AT24C64* EEPROM provides 64K bits of serial electrically erasable and programmable read-only memory. The serial EEPROM has an I2C address of 0xA0h and resides on Port 0 of the VSC410* controller.

4.3.4

General Purpose Input/Output (GPIO)

The VSC410* controller supports GPIO pins that are customizable. The following table lists the GPIO pins with their assigned functions.
Table 102. 6HDD VSC410* Controller GPIO Assignment VSC410* Pin Name P0_0 I/O Type O Power Well 3.3V Programming Description U3B1 FLASH ROM and FM_EEPROM_WP U3C1 EEPROM write protect control IPMB Address allocation input SMB_3V3_IPMB_AD D System Function Reset Initial State Value Connection

Pull up 4.7K to 3.3V Pull up 4.7K to 3.3V Pull up 4.7K to 3.3V Pull up 4.7K to 3.3V Pull up 4.7K to 3.3V Pull up 4.7K to 3.3V Pull up 4.7K to 3.3V Pull up 4.7K to 3.3V

P0_1 P0_2 P0_3 P0_4 P0_5 P0_6 P0_7

I O I O I O I

3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V

HDD0 Fault LED control LED_DRV0_FLT_N HDD0 Present detection FM_DRV0_PRSNT_ N

HDD1 Fault LED control LED_DRV1_FLT_N HDD1 Present detection FM_DRV1_PRSNT_ N

HDD2 Fault LED control LED_DRV2_FLT_N HDD2 Present detection FM_DRV2_PRSNT_ N

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VSC410* Pin Name P1_0 P1_1 P1_2 P1_3 P1_4 P1_5 P1_6 P1_7 P2_0 P2_1 P2_2 P2_3

I/O Type O I O I O I O O O O O O

Power Well 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V

Programming Description

System Function

Reset Initial State Value

Connection

HDD3 Fault LED control LED_DRV3_FLT_N HDD3 Present detection FM_DRV3_PRSNT_ N

Pull up 4.7K to 3.3V Pull up 4.7K to 3.3V Pull up 4.7K to 3.3V Pull up 4.7K to 3.3V Pull up 4.7K to 3.3V Pull up 4.7K to 3.3V

HDD4 Fault LED control LED_DRV4_FLT_N HDD4 Present detection FM_DRV4_PRSNT_ N

HDD5 Fault LED control LED_DRV5_FLT_N HDD5 Present detection Test Point Test Point Test Point Test Point Test Point Test Point FM_DRV5_PRSNT_ N TP_LED_DRV6_FLT _N TP_FM_DRV6_PRS NT_N TP_LED_DRV7_FLT _N TP_FM_DRV7_PRS NT_N TP_LED_DRV8_FLT _N

TP_FM_DRV8_PR SNT_N
TP_LED_DRV9_FLT _N TP_FM_DRV9_PRS NT_N TP_LED_DRV10_FL T_N TP_FM_DRV10_PR SNT_N SGPIO_CLK

P2_4 P2_5 P2_6 P2_7 P3_0

O O O O I/O

3.3V 3.3V 3.3V 3.3V 3.3V

Test Point Test Point Test Point Test Point Clock signal of SGPIO interface

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VSC410* Pin Name P3_1 P3_2 P3_3

I/O Type I/O I/O I/O

Power Well 3.3V. 3.3V 3.3V

Programming Description Load signal of SGPIO interface SDATAIN signal of SGPIO interface SDATAOUT signal of SGPIO interface

System Function

Reset Initial State Value

Connection

SGPIO_LOAD SGPIO_DATAOUT0 SGPIO_DATAOUT1

4.3.5

External Memory Device

The 6HDD passive SAS/SATA HSBP contains a non-volatile 8Mbit Serial SPI FLASH Memory for Boot and Run-Time/Configuration code storage. The device resides on the SPI interface of the VSC410* controller. The Serial SPI Flash memory operates from the 3.3V rail.

4.3.6

LEDs

The 6HDD passive SAS/SATA HSBPs contain a green STATUS LED and an amber FAULT LED for each of the hard disk drives. The STATUS LED is driven by the SAS/SATA hard disk drive itself. The FAULT LED is driven by the VSC410* controller whenever a condition, as defined by the firmware, is detected.
Table 103. LED Function Status LED Green On Blink (0.5s on 0.5s off, 50% duty cycle of a 1s) Blink (1s on 1s off, 50% duty cycle of a 2s) Amber on On Blink Condition Definition HDD Active Spin up/spin down(SAS HDD) Formating(SAS HDD) HDD Fail Rebuild

Note: For SAS drives, the green LED will be on when the drive is installed and ready. For SATA drives, the green LED will be off when the drive is installed and ready.

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4.3.7

SAS/SATA Drive Connectors

The 6HDD SAS/SATA HSBP provides four or six 22-pin SAS/SATA connectors for hot swap hard disk drives supporting a 1.5GHz and 3.0GHz transfer rate.
Table 104. 22-pin SAS/SATA Connector Pin-out Connector Contact Number S1 S2 S3 S4 S5 S6 S7 P1 P2 P3 P4 P5 P6 P7 P8 P9 P10 P11 P12 P13 P14 P15 Signal Name GND SATA_DRVnA_RX_P SATA_DRVnA_RX_N GND SATA_DRVnA_TX_N SATA_DRVnA_TX_P GND TP_DRVn_P1 TP_DRVn_P2 TP_DRVn_P3 GND GND FM_DRVn_PRSNT_N P5V_DRVn_PRECHG P5V P5V GND LED_DRVn_READY_N GND P12V_DRVn_PRECHG P12V P12V

4.3.8

Power Connectors

The six HDD passive SAS/SATA HSBP provides two standard 4-pin hard disk drive power connectors. The following table defines the pin-out of the 4-pin power connectors.

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Table 105. Power Connector Pin-out Pin 1 2 3 4 Signal P12V GND GND P5V

4.3.9

Clock Generation and Distribution

The 6HDD SAS/SATA HSBP provides one clock source. A 4-MHz crystal provides clock source to the VSC410* controller.

4.3.10

7-Pin SAS/SATA Host Connectors

The 6HDD passive SAS/SATA HSBP provides four or six 7-pin SAS/SATA connectors that will be connected to the host interface of the server board or HBA via a mated cable. The following table defines the pin-out of the 7-pin SAS/SATA host connector.
Table 106. 7-pin SAS/SATA Connector Pin-out Connector Contact Number S1 S2 S3 S4 S5 S6 S7
Note: n=0, 1, 2, 3, 4, 5.

Signal Name GND SATA_DRVnA_RX_P SATA_DRVnA_RX_N GND SATA_DRVnA_TX_N SATA_DRVnA_TX_P GND

4.3.11

IPMB Header - IPMB

The following table defines the pin-out of the 4-pin IPMB Header. This connector is white in color.

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Table 107. IPMB Header Pin-out Pin 1 2 3 4 Signal Name SMB_5VSTB_IPMB_DAT GND SMB_5VSTB_ IPMB_CLK SMB_5VSTB_ IPMB_ADDR Description Data GND Clock IPMI interface address selection. Primary (Low)= 0xC0, Secondary(High) = 0xC2

4.3.12

SGPIO Header - SGPIO

The following table defines the pin-out of the 4-pin SGPIO Header. This connector is black in color.
Table 108. SGPIO Header Pin-out Pin 1 2 3 4 Signal Name SGPIO_CLK SGPIO_LOAD SGPIO_DATAOUT0 SGPIO_DATAOUT1 Clock Load DATAIN DATAOUT Description

4.3.13

SES Header - SES

The following table defines the pin-out of the 3-pin SES Header. This connector is white in color.
Table 109. SES Header Pin-out Pin 1 2 3 Signal Name SMB_HBA_I2C_DAT GND SMB_HBA_I2C_CLK Data Ground Clock Description

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4.3.14

Passive Hot Swap Backplane (HSBP) Cables Explained

Passive backplanes ship with three cables. Depending on the intended configuration, the cables should be utilized in the following manner: 4.3.14.1 IPMB Cable

Always Installed white 4-pin IPMB connector on HSBP to white 4 pin IPMB connector on server board If using one HSBP (Primary), connect the cable to HSBP_A on the server board If using two HSBPs (Primary and Secondary), connect the second cable to the HSBP_B on the server board 4.3.14.2 SGPIO Cable

Always used when using onboard SATA or SAS black 4-pin connector on HSBP to black 4-pin SGPIO connector on server board If using the onboard SATA, connect the cable to the SATA GPIO connector on the server board If using the onboard SAS, connect the cable to the SAS GPIO connector on the server board 4.3.14.3 SES Cable

Only used with SAS controllers white 3-pin connector on HSBP to white 3-pin SES connector on server board Connect to white SES connector on server board, OR Connect to SES connector on add-in peripheral card 4.3.14.4 Board Layouts

The figure below shows the board layout and connector placement of the 6HDD passive SAS/SATA HSBP.

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A. SATA/SAS hot-swap drive connectors B. SATA/SAS cable connectors C. SES header D. SGPIO header E. IPMB header F. Power connectors Figure 25. Intel Server Chassis SC5650 6HDD Passive SAS/SATA HSBP Board Layout

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4.3.15

Connector Specifications
Table 110. 6HDD Passive SAS/SATA Hot Swap Backplane Connector Specifications

Quantity

Manufacturer and Part Number Molex* 15-244744 LOTES* ABASAT-032-T01 Foxconn* LD1807V-S52TC Wieson* G2420C888006H Wieson* G2420C888008H Wieson* G2420C888005H

Description

Color

Reference

2 6 2 1

CONN,PWR,4P,STD,PLG,V T,0.2,093ST,DISK D CONN, MISC, 22 P, THM SATA, VT CONN,MISC,7 P,THMT SATA,VT, SHRD CONN,HDR,1 X 4,PLG,VT,2MM,093ST,KP PG CONN,HDR,1 X 4,PLG,VT,2MM,093ST,KP PG CONN,HDR,1 X 3,PLG,VT,2MM,093ST,KP PG

Black Black Black White

J3F1,J4F1 J3L1,J3M1,J3N1,J3P1,J3R 1,J3T1 J3B1,J3B2, J3C1, J3D1, J3E1, J2E1 J4D1

Black

J4E1

White

J4E3

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Standard Control Panel

5.

Standard Control Panel

The Intel Server Chassis SC5650 control panel configuration has a three-button, five-LED control panel. When the hot-swap drive bay is installed, a bi-color hard drive LED is located on each drive carrier (six totals) to indicate specific drive failure or activity. These LEDs are visible upon opening the front bezel door.

5.1

Control Panel

The control panel buttons and LED indicators are displayed in the following figure. The Entry Ebay SSI (rev 3.61) compliant front panel header for Intel server boards is located on the back of the front panel. This allows for connection of a 24-pin ribbon cable for use with SSI rev 3.61compliant server boards. The connector cable is compatible with the 24-pin SSI standard.
A B C D

E F G H
TP00872

A. B. C. D. E. F. G. H.

Power / Sleep LED Power button NMI button Reset Button LAN # 1 Activity LED LAN # 2 Activity LED Hard Drive Activity LED Status LED

Figure 26. Panel Controls and Indicators

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Table 111. Control Panel LED Functions LED Name Power/Sleep LED Color Green Condition ON OFF LAN # 1Link/Activity Green ON BLINK OFF LAN # 2Link/Activity Green ON BLINK OFF Hard drive activity Green BLINK OFF Status LED Green ON BLINK Amber ON BLINK OFF Power on Power off Linked LAN activity Disconnected Linked LAN activity Disconnected Hard drive activity No activity System ready (not supported by all server boards) Processor or memory disabled Critical temperature or voltage fault; CPU/Terminator missing Power fault; Fan fault; Non-critical temperature or voltage fault Fatal error during POST Description

Note: This is dependent on server board support. Not all server boards support all features. For additional details about control panel functions supported for a specific board, refer to the individual server board specifications.

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Intel Local Control Panel

6.

Intel Local Control Panel

The Intel Local Control Panel (iLCP) utilizes a combination of control buttons, LEDs, and an LCD display to provide system accessibility, monitoring, and control functions independently from the operating system. Combined with an Intel Management Module, the iLCP allows a user to monitor the health of an Intel server platform or configure an Intel server for remote IPMI management. The control panel assembly is pre-assembled and is modular in design. The module slides into a slot on the front of the chassis and is designed so that it can be adjusted for use with or without an outer front bezel.

Figure 27. SKU3 - Pedestal Server Application

Note: The Intel Local Control Panel can only be used when either the Intel Management Module Professional Edition or Advanced Edition is installed in the system. More information regarding the Intel Local Control Panel can be found on the Intel support web site. The following diagram provides an overview of control panel features.

B C D E

A B C D E

LCD Display (Variable content) LCD Up Navigation Button LCD Down Navigation Button LCD Backup Level Navigation Button LCD Command Enter Button Figure 28. Local Control Panel Components

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6.1

Internal Control Panel Headers


A 4-pin header provides control and status information to / from the server board via the IPMB interface. A 4-pin round cable connects the iLCP to the server board.

The control panel interface board has one internal header:

The following table provides the pin-out for each of these headers.
Table 112. IPMI Header Pin # 1 2 3 4

Description IPMB_5VSB_SDA GND IPMB_5VSB_SCL P5V_STBY

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7.
7.1

System Interconnection
Signal Definitions

The pin-outs for the connectors referred to in this section are defined in the respective server board Technical Product Specification.

7.2
7.2.1

Chassis Internal Cables


Control Panel Cable

A 24-conductor ribbon cable with 24-pin IDC connectors links the control panel to the SSI EEB Revision 3.61-compliant server board.

7.2.2

USB Cable

An 8-conductor USB cable with a 10-pin server board connector and two 4-pin external USB connectors is used to connect the front mounted USB connectors to the server board.

7.2.3

Fan Connector

The installed system fan provides a 4-pin connector that is designed to mate with a SSI (ATX*)3 and 4-pin compatible fan header.

7.2.4

Chassis Intrusion Cable

A 2-conductor chassis intrusion cable is included with the chassis kit. It is connected to the control panel through a 2-pin chassis intrusion header on the control panel board.

7.3

Server Board Internal Cables

Depending on the specific server board support for these features, some or all of the following cables may be included as part of the boxed board kit: Serial cable: One 9-conductor cable terminated in a 2x5 header at one end and a 9-pin panel mount D sub-connector on the other (ships with the server board, not the chassis). SATA/SAS data cable: One or more cables with 7 contact connectors. These connectors may feature a right angle or straight housing design.

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7.4 7.5

Accessory Cables I/O Panel Connectors

The Intel Server Chassis SC5650 provides an ATX 2.2 and SSI E-bay 3.61-compliant I/O aperture for the backside I/O. The specific panel used will be provided in the boxed server board kit. The following are typical panel connections: 9-pin serial port(s) USB port(s) 15-pin video port Ethernet RJ-45 connector(s)

7.6

Spares and Accessories


APP3RACKIT FXXPPT600WPSU APPT600WHPSU FPPTBRPCAGE Description Rack mounting kit Replacement 600-W power supply for DP 2nd Redundant 600W PSU for BRP. Spare BRP redundant power supply cage Chassis Preventative Maintenance Kit for Intel Server Chassis SC5650 family. Includes (2) Hard Drive Bay Lockers with Screws and Spring, (1) Air Duct, (1) Intrusion Switch Assembly, (1) USB Cable, (1) Rear 120mm Fixed Fan Holder with Screws, (1) 92mm Fan Holder with Screws, (1) Full-length PCI Card Guide, (1) Front 120mm Fixed Fan with Screws, (1) Adapter Plate with Screws for Fixed Power Supply, (1) Fixed Power supply tool-less locker, (4) Chassis Feet, , (1) Fixed HDD Fan Plate 4 wire fan kit for Intel Server Chassis SC5650. Includes (1) 4 wire PCI Fan & (2) 4 wire rear fan & (1) 4 wire HDD fan. Hot-swap drive cooling and mounting Kit for Intel Server Chassis SC5650, Includes one fan holder and two Hot-swap cage brackets, and one 92mm fan. This mounting kit is required when using 6-bay Hot-swap Hard Disk Cage AXX6DRV3GR Hot-swap bay mounting bracket kit (includes 2 brackets, one fan shroud, and one 92-mm fan). This mounting kit is required when using 6-bay Hot-swap Hard Disk Cage AXX6DRV3GEXP

Product Code

FPPTPMKIT

FPPTFANKIT4W

APPTHSDBKIT

APP3HSDBKIT

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Product Code APP3STDBEZEL FXXPPTFPBRD

AXX6DRV3GEXP

AXX6DRV3GR

Description Standard bezel (WS, DP, BRP) Replacement front panel board 6-drive hot-swap, expander SATA/SAS backplane assembly cage kit for Intel Server Chassis SC5600/SC5650. Requires 2 SAS ports from SAS personality module or RAID card and is compatible with SAS or SATA 3.5 hard drives. Includes: backplane board, 6 drive carriers, 2 Data cables, 6-drive bay, IPMB cable, common installation guide, SATA/SAS configuration label. 6-drive hot-swap non-expanded SATA/SAS backplane assembly cage kit for Intel Server Chassis SC5600 / SC5650 family. Requires 6 SAS ports from RAID card for SAS (or SATA) 3.5 hard drive support or 6 SATA ports from baseboard or RAID card for SATA 3.5 hard drive support. Includes: Backplane board, 6 drive carriers, 6 data cables, 6-drive bay, IPMB cable, SES cable and SGPIO cable, common installation guide, SATA/SAS configuration label.

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Supported Intel Server Boards

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8.

Supported Intel Server Boards

The Intel Server Chassis SC5650 is mechanically and functionally designed to support the following Intel server boards: Intel Server Board S5520HC Intel Server Board S5500HCV Intel Server Board S5520SC Intel Server Board S5500BC

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9.
9.1

Regulatory, Environmentals, and Specifications


Product Regulatory Compliance
WARNING

To ensure regulatory compliance, you must adhere to the assembly instructions included with this chassis to ensure and maintain compliance with existing product certifications and approvals. Use only the described, regulated components specified in this specification. Use of other products / components will void the UL listing and other regulatory approvals of the product and will most likely result in noncompliance with product regulations in the region(s) in which the product is sold. The final configuration of your end system product may require additional EMC compliance testing. For more information, please contact your local Intel Representative. This is an FCC Class A device. Integration of it into a Class B chassis does not result in a Class B device. This server chassis product, when correctly integrated, complies with the following safety and electromagnetic compatibility (EMC) regulations.

9.1.1

Product Safety Compliance

The Intel Server Chassis SC5650 complies with the following safety requirements: UL60950 CSA 60950(USA / Canada) EN60950 (Europe) IEC60950 (International) CB Certificate & Report, IEC60950 (report to include all country national deviations) GS License (Germany) GOST R 50377-92 - License (Russia) Belarus Licence (Belarus) Ukraine Licence (Ukraine) CE - Low Voltage Directive 73/23/EEE (Europe) IRAM Certification (Argentina) GB4943- CNCA Certification (China)

9.1.2

Product EMC Compliance Class A Compliance

The Intel Server Chassis SC5650 has been tested and verified to comply with the following electromagnetic compatibility (EMC) regulations when configured with an Intel compatible server board. For information on compatible server boards, refer to the Intel website or contact your local Intel representative.
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FCC /ICES-003 - Emissions (USA/Canada) Verification CISPR 22 Emissions (International) EN55022 - Emissions (Europe) EN55024 - Immunity (Europe) EN61000-3-2 - Harmonics (Europe) EN61000-3-3 - Voltage Flicker (Europe) CE EMC Directive 89/336/EEC (Europe) VCCI Emissions (Japan) AS/NZS 3548 Emissions (Australia / New Zealand) BSMI CNS13438 Emissions (Taiwan) GOST R 29216-91 Emissions (Russia) GOST R 50628-95 Immunity (Russia) Belarus License (Belarus) Ukraine License (Ukraine) RRL MIC Notice No. 1997-41 (EMC) & 1997-42 (EMI) (Korea) GB 9254 - CNCA Certification (China) GB 17625 - (Harmonics) CNCA Certification (China)

9.1.3

Product Ecology Requirements


All materials, parts and subassemblies do not contain restricted materials as defined in Intels Environmental Product Content Specification of Suppliers and Outsourced Manufacturers. The Environmental Content Specification includes the ban of substances noted in the European Restriction of Hazardous Substances (RoHS) Directive 2002/95/EC http://supplier.intel.com/ehs/environmental.htm. Plastic parts do not use brominated flame retardant or any other halogenated retardants that are not accepted by environmental programs, such as Blue Angels, Nordic White Swan, and Swedish TCO. All plastic parts that weigh >25gm are marked with the ISO11469 requirements for recycling. Example: >PC/ABS< Packaging materials may not contain more than 100 ppm (total) of lead, cadmium, chromium or mercury. If sold as a retail product, packaging materials must be marked with applicable recycling logos for Europe (green dot) and Japan (Eco-marks). All cords and cables contain <100 ppm of cadmium.

9.1.4

Certifications / Registrations / Declarations


UL Certification (US/Canada) CE Declaration of Conformity (CENELEC Europe) FCC/ICES-003 Class A Attestation (USA/Canada) VCCI Certification (Japan) C-Tick Declaration of Conformity (Australia) MED Declaration of Conformity (New Zealand)

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BSMI Certification (Taiwan) GOST R Certification / Licence (Russia) Belarus Certification / Licence (Belarus) RRL Certification (Korea) IRAM Certification (Argentina) CNCA Certification (China) Ecology Declaration (International)

9.1.5

Product Regulatory Compliance Markings

This Intel server chassis products have the following regulatory marks.
Regulatory Compliance Region Marking

cULus Listing Marks

USA/Canada

GS Mark CE Mark FCC Marking (Class A)

Germany Europe USA

EMC Marking (Class A) C-Tick Mark

Canada Australia / New Zealand Japan

VCCI Marking (Class A)

BSMI Certification Number & Class A Warning

Taiwan

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Region

Marking

GOST R Marking

Russia

RRL MIC Mark China Compulsory Certification Mark

Korea China

9.2
9.2.1

Electromagnetic Compatibility Notices


FCC Verification Statement (USA)

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Intel Corporation 5200 N.E. Elam Young Parkway Hillsboro, OR 97124-6497 Phone: 1-800-628-8686 This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Re-orient or relocate the receiving antenna. Increase the separation between the equipment and the receiver. Connect the equipment to an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio / TV technician for help. Any changes or modifications not expressly approved by the grantee of this device could void the users authority to operate the equipment. The customer is responsible for ensuring compliance of the modified product.

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Only peripherals (computer input / output devices, terminals, printers, etc.) that comply with FCC Class A or B limits may be attached to this computer product. Operation with noncompliant peripherals is likely to result in interference to radio and TV reception. All cables used to connect to peripherals must be shielded and grounded. Operation with cables connected to peripherals that are not shielded and grounded may result in interference to radio and TV reception.

9.2.2

ICES-003 (Canada)

Cet appareil numrique respecte les limites bruits radiolectriques applicables aux appareils numriques de Classe A prescrites dans la norme sur le matriel brouilleur: Appareils Numriques, NMB-003 dicte par le Ministre Canadian des Communications. (English translation of the notice above) This digital apparatus does not exceed the Class A limits for radio noise emissions from digital apparatus set out in the interference-causing equipment standard entitled Digital Apparatus, ICES-003 of the Canadian Department of Communications.

9.2.3

Europe (CE Declaration of Conformity)

This product has been tested in accordance to, and complies with the Low Voltage Directive (73/23/EEC) and EMC Directive (89/336/EEC). The product has been marked with the CE Mark to illustrate its compliance.

9.2.4

Japan EMC Compatibility

Electromagnetic Compatibility Notices (International)

English translation of the above notice: This is a Class A product based on the standard of the Voluntary Control Council For Interference (VCCI) from Information Technology Equipment. If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual.

9.2.5

BSMI (Taiwan)

The BSMI Certification number and the following warning is located on the product safety label, which is located on the bottom side (pedestal orientation) or side (rack mount configuration).

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9.2.6

RRL (Korea)

Following is the RRL certification information for Korea.

English translation of the notice above: 1. 2. 3. 4. 5. Type of Equipment (Model Name): On License and Product Certification No.: On RRL certificate. Obtain certificate from local Intel representative Name of Certification Recipient: Intel Corporation Date of Manufacturer: Refer to date code on product Manufacturer/Nation: Intel Corporation/Refer to country of origin marked on product

9.2.7

CNCA (CCC-China)

The CCC Certification Marking and EMC warning is located on the outside rear area of the product. A

9.3

Regulated Specified Components

To maintain the UL listing and compliance to other regulatory certifications and/or declarations, the following regulated components must be used and conditions adhered to. Interchanging or use of other component will void the UL listing and other product certifications and approvals. Server Chassis - (Base chassis is provided with power supply and fans)UL listed. Server board - Must use an Intel server boardUL recognized. Add-in boards - Must have a printed wiring board flammability rating of minimum UL94V-1. Add-in boards containing external power connectors and / or lithium batteries must be UL recognized or UL listed. Any add-in board containing modem telecommunication circuitry must be UL listed. In addition, the modem must have the appropriate telecommunications, safety, and EMC approvals for the region in which it is sold. Peripheral Storage Devices - must be UL recognized or UL listed accessory and TUV or VDE licensed. Maximum power rating of any one device is 19 watts. Total

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server configuration is not to exceed the maximum loading conditions of the power supply.

9.4

End of Life / Product Recycling

Product recycling and end-of-life take back systems and requirements vary from country to country. Contact the retailer or distributor of this product for information on product recycling and / or take back.

9.5

Restriction of Hazardous Substances (RoHS) Compliance

Intel has a system in place to restrict the use of banned substances in accordance with the European Directive 2002/95/EC. Compliance is based on declaration that materials banned in the RoHS Directive are either (1) below all applicable substance threshold limits, or (2) an approved/pending RoHS exception applies. Note: RoHS implementing details are not fully defined and may change. Threshold limits and banned substances are noted as follows: Quantitiy limit of 0.1% by mass (1000 PPM) for: o o o o Lead Mercury Hexavalent Chromium Polybrominated Biphenyls Diphenyl Ethers (PBDE, PBB)

Quantity limit of 0.01% by mass (100 PPM) for: o Cadmium

9.6

Replacing the Back up Battery

The lithium battery on the server board powers the real time clock (RTC) for up to 10 years in the absence of power. When the battery starts to weaken, it loses voltage, and the server settings stored in CMOS RAM in the RTC (for example, the date and time) may be wrong. Contact your customer service representative or dealer for a list of approved devices. WARNING Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the equipment manufacturer. Discard used batteries according to manufacturers instructions. ADVARSEL! Lithiumbatteri - Eksplosionsfare ved fejlagtig hndtering. Udskiftning m kun ske med batteri af samme fabrikat og type. Levr det brugte batteri tilbage til leverandren.
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ADVARSEL Lithiumbatteri - Eksplosjonsfare. Ved utskifting benyttes kun batteri som anbefalt av apparatfabrikanten. Brukt batteri returneres apparatleverandren. VARNING Explosionsfara vid felaktigt batteribyte. Anvnd samma batterityp eller en ekvivalent typ som rekommenderas av apparattillverkaren. Kassera anvnt batteri enligt fabrikantens instruktion. VAROITUS Paristo voi rjht, jos se on virheellisesti asennettu. Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin. Hvit kytetty paristo valmistajan ohjeiden mukaisesti.

9.7

System-level Environmental Limits

The following table defines the system level operating and non-operating environmental limits (office or computer room environment).
Table 113. System Office Environment Summary Parameter Operating temperature Non-operating temperature Non-operating humidity Acoustic noise Shock, operating Shock, unpackaged Shock, packaged Vibration, unpackaged Vibration, packaged ESD* System Cooling Requirement in BTU/hr 5C to 40C -40C to 70C 35C @ 90% RH Workstation: 5.1 BA 2g, 11 ms 1/2 Sine, 20g, 2ms, 1/2 Sine 25G Trapezoidal Shock 24" Free Fall, >40, <80lbs; 30" Free Fall, >20, <40lbs 5Hz to 500Hz, 2.2 grms random profile 5Hz to 500Hz, 1.09 grms random profile 2kV to 15 kV Air Discharge, 2kV to 8kV Contact Discharge Limits

*IMPORTANT NOTE:
The chassis with Intel Server Board S5500BC requires the use of shielded LAN cable to comply with Immunity regulatory requirements. Use of non shield cables may result in the product having insufficient immunity electromagnetic effects, which may cause improper operation of the product.

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9.8

Serviceability and Availability

This system is designed to be serviced by qualified technical personnel only. The desired Mean Time To Repair (MTTR) of the system is 30 minutes including diagnosis of the system problem. To meet this goal, the system enclosure and hardware have been designed to minimize the MTTR. Following are the maximum times that a trained field service technician should take to perform the listed system maintenance procedures, after diagnosis of the system.
Table 114. Mean Time To Repair Estimate Activity Remove cover Remove and replace hard disk drive Remove and replace 5.25-inch peripheral device Remove and replace fixed power supply module Remove and replace hot-swap power supply module Remove and replace drive cage fan Remove and replace system fan Remove and replace backplane board Remove and replace control panel board Remove and replace server board Time Estimate < 1 minute 1 minute 1 minute 1 minute < 1 minute 5 minutes 1 minute 5 minutes 5 minutes 5 minutes

9.9

Calculated MTBF

The calculated MTBF (Mean Time Between Failures) for the Intel Server Chassis SC5650, as configured from the factory, is presented in the following tables.

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Table 115. Intel Server Chassis SC5650 Component MTBF Server Model Subassembly (Server in 35 degrees C ambient air) DP, WS Standard Configuration MTBF (hours) Power Supply Power Supply (nonredundant with power distribution board) Cooling fan Hot-swap Backplane Front Panel Board Intrusion Switch Total Chassis Assembly 7,000,000 25,000,000 82100 143 40 12,183 500,000 2,000 500,000 1,500,000 7,000,000 25,000,00 0 77900 2,000 667 143 40 12,850 100,000 FIT (flrs/10^9 hrs) 10,000 DP, WS With HSBP MTBF (hours) 100,000 FIT (flrs/10^ 9 hrs) 10,000

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Server Model Subassembly (Server in 35 degrees C ambient air) BRP Standard Configuration FIT (flrs/10^9 hrs) BRP With HSBP FIT (flrs/10^9 hrs)

MTBF (hours) Power Supply Power Supply (non-redundant with power distribution board) Cooling fan Hot-swap Backplane Front Panel Board Intrusion Switch Total Chassis Assembly 7,000,000 25,000,000 75300 90,000 500,000

MTBF (hours)

11,111 2,000

90,000 500,000 1,500,000

11,111 2,000 667 143 40 13,961

143 40 13,294

7,000,000 25,000,000 71700

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Appendix A: Integration and Usage Tips

Intel Server Chassis SC5650 TPS

Appendix A: Integration and Usage Tips


This appendix provides a list of useful information that is unique to the Intel Server Chassis SC5650 and should be kept in mind while integrating and configuring your server. To maintain system thermals, fixed hard drive bays must be populated in the slots in this order: 1, 3, 5, 2, 4, 6. To maintain system thermals, hot-swap hard drive bays must be populated with either a hard drive or a drive blank. System fans are not hot swappable. If required, the CPU air duct(s) must be used to maintain system thermals. A CPU air duct is not required on the Intel Server Board S5500BC. The chassis with Intel Server Board S5500BC requires the use of shielded LAN cable to comply with Immunity regulatory requirements. Use of non shield cables may result in the product having insufficient immunity electromagnetic effects, which may cause improper operation of the product. The Intel Local Control Panel can only be used with systems configured with an Intel Management Module. Make sure the latest system software is loaded on the server. This includes system BIOS, FRU/SDR, BMC firmware, and hot-swap controller firmware. The latest system software can be downloaded from:http://support.intel.com/support/motherboards/server/

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Glossary

Glossary
Word / Acronym ACA ANSI ATX Auto-Ranging Australian Communication Authority American National Standards Institute Advanced Technology Extended Power supply that automatically senses and adjust itself to the proper input voltage range (110 VAC or 220 VAC). No manual switches or manual adjustments are needed. Baseboard Management Controller Cubic Feet per Minute (airflow) Complementary Metal Oxide Silicon A condition that allows the line voltage input to the power supply to drop to below the minimum operating voltage. Entry E-Bay Emergency Management Port Front Panel Fault Resilient Booting Field Replaceable Unit Hot Swap Backplane A power supply, after detecting a fault condition, shuts itself off. Even if the fault condition disappears the supply does not restart unless manual or electronic intervention occurs. Manual intervention commonly includes briefly removing and then reconnecting the supply, or it could be done through a switch. Electronic intervention could be done by electronic signals in the Server System. Liquid Crystal Display Local Control Panel Low-Pin Count A waveform changes from one level to another in a steady fashion, without intermediate retrenchment or oscillation. Mean Time Between Failure Mean Time to Repair Definition

BMC CFM CMOS Dropout EEB EMP FP FRB FRU HSBP Latch Off

LCD LCP LPC Monotonically MTBF MTTR

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Word / Acronym Noise OTP Over-current

Definition The periodic or random signals over frequency band of 10 Hz to 20 MHz. Over Temperature Protection A condition in which a supply attempts to provide more output current than the amount for which it is rated. This commonly occurs if there is a short circuit condition in the load attached to the supply. Over Voltage Protection Power Distribution Board Power Factor Correction Power Supply Unit A typical logic level output signal provided by the supply that signals the Server System that all DC output voltages are within their specified range Ring Indicate The periodic or random signals over frequency band of 10 Hz to 20 MHz. Rise time is defined as the time it takes any output voltage to rise from 10% to 95% of its nominal voltage. The condition where the AC line voltage drops below the nominal voltage conditions Single Connector Attachment Sensor Data Record Single-Ended Server Standards Infrastructure The condition where the AC line voltage rises above nominal voltage. Total Harmonic Distortion Universal Asynchronous Receiver Transmitter Universal Serial Bus Voluntary Control Council for Interference An output voltage that is present whenever AC power is applied to the AC inputs of the supply.

OVP PDB PFC PSU PWOK RI Ripple Rise Time Sag SCA SDR SE SSI Surge THD UART USB VCCI VSB or Stand By

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